Electronic component comprising predominantly organic functional materials and a method for the production thereof

An electronic component comprising:

• a first layer;
• a disruption element comprising a truncated conical in cross section profile through plating that is solely truncated and located on a portion of the first layer over a given region of the first layer;
• and
• a plurality of layers of different materials applied successively to the first layer, at least one of which plurality of layers is contiguous with the first layer and a further layer of the plurality of layers is contiguous with the one layer, at least a first portion of the plurality of layers comprising predominantly organic material;
• the disruption element being arranged to result in a void that exposes the disruption element in at least one layer of a second portion of the plurality of layers in the area adjacent to the disruption element in response to the at least one layer of the second portion of the plurality of layers being applied to both the first layer and to the disruption element.

An electronic component comprising:

• a first layer;
• a disruption element comprising a carbon black layer on a portion of the first layer over a given region of the first layer;
• and
• a plurality of layers of different materials applied successively to the first layer, at least one of which plurality of layers is contiguous with the first layer and a further layer of the plurality of layers is contiguous with the one layer, at least a first portion of the plurality of layers comprising predominantly organic material;
• the disruption element being arranged to result in a void that exposes the disruption element in at least one layer of a second portion of the plurality of layers in the area adjacent to the disruption element in response to the at least one layer of the second portion of the plurality of layers being applied to both the first layer and to the disruption element.

A method of forming an electronic component comprising:

• forming a lower layer;
• forming a free-standing solely truncated conical cross-sectional profile through plating overlying and contiguous with the lower layer, the through plating extending and tapering from a lower cross sectional area at the lower layer to an uppermost cross sectional area smaller than the lower cross sectional area;
• forming a plurality of further layers overlying and contiguous with the lower layer surrounded by and contacting the through plating extending therethrough, at least one of which further layers forms a central layer, at least two of which plurality of further layers are organic functional layers and at least one of which further layers forms a first upper layer;
• and
• forming a second upper layer overlying and contiguous with the first upper layer and with the through plating;
• wherein at least two of the layers are ohmically coupled to the through plating.

A process for the production of an electronic component comprising:

• forming a plurality of layers of different materials including a first lower layer, a majority of which plurality of layers are of predominantly organic material and which plurality of layers includes an insulating layer;
• the forming of the first lower layer being followed by forming subsequent layers of the plurality of layers deposited sequentially and contiguously with one on the other, at least one of the subsequently deposited layers being deposited contiguously onto the first lower layer;
• forming a carbon black disruption element on the first lower layer, which element results in a void in at least one layer of the subsequently deposited layers;
• and
• ohmically coupling the at least two layers of the subsequently deposited layers to each other.