Electrical property altering, planar member with solder element in IC chip package
AssigneeInternational Business Machines Corporation
InventorsJ. Richard Behun, David B. Stone
Life of this patent
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Abstract
A structure includes a solder element for electrically coupling a substrate of an integrated circuit (IC) chip package and a printed circuit board (PCB); and a first electrical property altering, substantially planar member positioned between the solder element and at least one of a landing pad of the substrate and a landing pad of the PCB. In another embodiment, the electrical property altering, planar member can be applied to the solder element(s) between the IC chip and the package substrate.
Claims20
A structure comprising:
- a solder element for electrically coupling a substrate of an integrated circuit (IC) chip package and a printed circuit board (PCB), wherein the solder element is part of one of:
- a flip chip plastic ball grid array (FC-PBGA), an enhanced plastic ball grid array (EPBGA), a ceramic ball grid array (CBGA), a ceramic column grid array (CCGA), or a fine pitch ball grid array (FBGA);
- a first electrical property altering, substantially planar member positioned between the solder element and a landing pad of the substrate;
- and
- a second electrical property altering, substantially planar member positioned between the solder element and a landing pad of the PCB.
An integrated circuit (IC) chip package comprising:
- an IC chip positioned on a substrate;
- a lead wire extending from the IC chip;
- a printed circuit board (PCB);
- a solder element for electrically coupling the substrate and the PCB;
- and
- an electrical property altering, substantially planar member electrically coupling the lead wire to the PCB.
A structure comprising:
- a solder element for electrically coupling an integrated circuit (IC) chip and a printed circuit board (PCB), wherein the solder element is part of one of:
- a flip chip plastic ball grid array (FC-PBGA), an enhanced plastic ball grid array (EPBGA), a ceramic ball grid array (CBGA), a ceramic column grid array (CCGA), or a fine pitch ball grid array (FBGA);
- a first electrical property altering, substantially planar member positioned between the solder element and a landing pad of the IC chip;
- and
- a second electrical property altering, substantially planar member positioned between the solder element and a landing pad of the PCB.
Dependencies are inferred from the claim text.