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US 8,044,511 B2Granted
Function element and function element mounting structure
AssigneeKYOCERA Corporation
InventorsKenichi Kato, Yoshio Shimoaka
Life of this patent
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Abstract
The semiconductor device is manufactured by forming a lower electrode layer 2 having a predetermined pattern on a semiconductor substrate 1 and forming an upper electrode layer 3 on a part of the top surface of the lower electrode layer 2, while holes 2X extending in the direction of thickness are formed on the top surface of the lower electrode layer 2 below the upper electrode layer 3, and the depth of holes 2X is smaller than the thickness of the lower electrode layer 2.
Claims9
A functional device comprising:
- a substrate,
- a lower electrode layer formed on a principal surface of the substrate and
- an upper electrode layer formed on a part of a top surface of the lower electrode layer,
- wherein a plurality of holes are formed in the lower electrode layer so as to extend from an interface region between the lower electrode layer and the upper electrode layer in the direction of thickness of the lower electrode layer, and wherein some of said plurality of holes go through said lower electrode layer to said substrate and some of said plurality of holes have a depth smaller than the thickness of the lower electrode layer.
1 more element
Dependencies are inferred from the claim text.