Method and apparatus for integrated-circuit battery devices

An integrated circuit package, comprising:

• a thin-film battery having an anode and a cathode, wherein the thin-film battery includes a plurality of layers successively deposited on one another as solid-state thin-film layers;
• a lead-frame;
• an integrated circuit die;
• and
• an encapsulant material encapsulating the thin-film battery, the lead-frame and the integrated circuit die, wherein the thin-film battery is fabricated on the lead-frame, the lead-frame is electrically coupled to one of the anode and cathode, and the integrated circuit die is electrically coupled to the lead-frame and the other of the anode and cathode, wherein the plurality of layers of the thin-film battery comprises an electrolyte layer, and wherein the electrolyte layer includes a LiPON material.

An integrated circuit package, comprising:

• a thin-film battery having first and second conductive surfaces on opposing sides of the thin-film battery, wherein the thin-film battery includes a plurality of layers successively deposited on one another as solid-state thin-film layers, wherein the plurality of layers of the thin-film battery includes a first electrode layer, a second electrode layer, and an electrolyte layer located between and electrically isolating the first electrode layer from the second electrode layer, wherein the electrolyte layer includes a LiPON material, and wherein at least one layer selected from the group consisting of the first electrode layer and the second electrode layer includes an intercalation material;
• a lead-frame electrically coupled to the first conductive surface;
• an integrated circuit die electrically coupled to the second conductive surface;
• and
• an encapsulant material encapsulating the thin-film battery, the lead-frame and the integrated circuit die.