Thermal-emitting memory module, thermal-emitting module socket, and computer system
AssigneeSamsung Electronics Co., Ltd.
InventorsYoung Yun, Soo-Kyung Kim, Kwang-Seop Kim, Ki-Hyun Ko, Sung-Joo Park
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Abstract
The invention provides a thermal-emitting memory module, a thermal-emitting module socket, and a computer system comprising the thermal-emitting memory module and the thermal-emitting module socket. An embodiment of the thermal-emitting module includes: a module substrate having electrically-conductive traces; and a semiconductor device disposed on the module substrate and coupled to the electrically-conductive traces, the module substrate including a thermal-emitting portion disposed in proximity of the semiconductor device without directly contacting the semiconductor device.
Claims16
A thermal-emitting module comprising:
- a module substrate having electrically-conductive traces;
- and
- a semiconductor device disposed on the module substrate and coupled to the electrically-conductive traces, the module substrate including a thermal-emitting portion disposed in proximity of the semiconductor device without directly contacting the semiconductor device, wherein the thermal-emitting portion includes:
- a thermal-emitting hole passing through the module substrate;
- and
- a thermal-emitting body disposed in the thermal-emitting hole and protruding inwardly from a sidewall of the thermal-emitting hole, the thermal-emitting body including at least one of a thermally-conductive material and a thermally-insulating material.
A thermal-emitting module socket configured to couple to a thermal-emitting module, the thermal-emitting module socket comprising a socket body, the socket body including:
- a connecting portion disposed in a center region of the socket body;
- and
- a fluid storing portion disposed in a peripheral region surrounding the center region, wherein
- the socket body includes a plurality of openings to an interior of the fluid storing portion.
A computer system comprising:
- a thermal-emitting module including:
- a module substrate having electrically-conductive traces;
- and
- a semiconductor device disposed on the module substrate and coupled to the electrically-conductive traces, the module substrate including a thermal-emitting portion disposed in proximity of the semiconductor device without directly contacting the semiconductor device;
- and
- a thermal-emitting module socket coupled to the thermal-emitting module, the thermal-emitting module socket including a socket body, the socket body having:
- a connecting portion;
- and
- a fluid storing portion, the socket body having a plurality of openings to an interior of the fluid storing portion.
Dependencies are inferred from the claim text.