Semiconductor device including an inner conductive layer which is cut out in the vicinity of a corner
AssigneeKabushiki Kaisha Toshiba
InventorTooru Suda
Life of this patent
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Abstract
A semiconductor device, includes: an organic multilayer wiring substrate having an inner conductive layer; a semiconductor element mounted and connected on one surface of the wiring substrate; and a plurality of solder balls disposed on the other surface in a grid array. A defect portion is formed at an area corresponding to a corner solder ball disposed at an outer peripheral corner, or at an area corresponding to the corner solder ball and peripheral solder balls at the inner conductive layer. Temperature rises of the solder balls disposed in a vicinity of the corner are suppressed, and therefore, the semiconductor device of which fatigue life is prolonged and superior in reliability can be obtained.
Claims20
A semiconductor device, comprising:
- a wiring substrate including an insulating layer composed of an organic insulating base material and an inner conductive layer;
- a semiconductor element mounted on one surface of the wiring substrate, and electrically connected to the wiring substrate;
- and
- a plurality of solder balls disposed on the other surface of the wiring substrate,
- wherein an area of the inner conductive layer is cut out, the area corresponding to the solder ball disposed at an outer peripheral corner portion, or an area corresponding to the solder balls disposed at the outer peripheral corner portion and at a periphery thereof.
A semiconductor device, comprising:
- a wiring substrate including an insulating layer composed of an organic insulating base material and an inner conductive layer;
- a semiconductor element mounted on one surface of the wiring substrate, and electrically connected to the wiring substrate;
- and
- a plurality of solder balls disposed on the other surface of the wiring substrate,
- wherein the inner conductive layer has:
- a main area, and
- a corner area isolated from the main area by a slit shape area without the inner conductive layer and a solder ball.
Dependencies are inferred from the claim text.