QFN semiconductor package
AssigneeMediatek Inc.
InventorsTung-Hsien Hsieh, Nan-Cheng Chen
Life of this patent
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Abstract
A QFN semiconductor package includes a die attach pad; a semiconductor die mounted on the die attach pad; an inner terminal lead disposed adjacent to the die attach pad; a first wire bonding the inner terminal lead to the semiconductor die; an extended, outer terminal lead disposed along periphery of the QFN semiconductor package, wherein the extended, outer terminal lead is disposed beyond a maximum wire length which is provided for a specific minimum pad opening size on the semiconductor die; an intermediary terminal disposed between the inner terminal lead and the extended, outer terminal lead; a second wire bonding the intermediary terminal to the semiconductor die; and a trace interconnecting the intermediary terminal to the extended, outer terminal lead.
Claims12
A quad flat non-lead (QFN) semiconductor package, comprising:
- a die attach pad;
- a semiconductor die mounted on the die attach pad;
- an inner terminal lead disposed adjacent to the die attach pad;
- a first wire bonding the inner terminal lead to the semiconductor die;
- an extended, outer terminal lead disposed along periphery of the QFN semiconductor package, wherein the extended, outer terminal lead is disposed beyond a maximum wire length that a wire bonder can provide with respect to a specific minimum pad opening size on the semiconductor die;
- an intermediary terminal disposed between the inner terminal lead and the extended, outer terminal lead;
- a second wire bonding the intermediary terminal to the semiconductor die;
- and
- a trace interconnecting the intermediary terminal to the extended, outer terminal lead.
A quad flat non-lead (QFN) semiconductor package, comprising:
- a die attach pad;
- a semiconductor die mounted on the die attach pad;
- an inner terminal lead disposed adjacent to the die attach pad;
- a first wire bonding the inner terminal lead to the semiconductor die;
- an extended, outer terminal lead disposed along periphery of the QFN semiconductor package;
- an intermediary terminal disposed between the inner terminal lead and the extended, outer terminal lead, wherein the intermediary terminal occupies a bonding surface area smaller than that of the extended, outer terminal lead;
- a second wire bonding the intermediary terminal to the semiconductor die;
- and
- a trace interconnecting the intermediary terminal to the extended, outer terminal lead.
A quad flat non-lead (QFN) semiconductor package, comprising:
- a die attach pad;
- a semiconductor die mounted on the die attach pad;
- an inner terminal lead disposed adjacent to the die attach pad;
- a first wire bonding the inner terminal lead to the semiconductor die;
- an extended, outer terminal lead disposed along periphery of the QFN semiconductor package;
- an intermediary terminal disposed between the inner terminal lead and the extended, outer terminal lead, wherein the intermediary terminal has a recessed bottom surface that is not coplanar with a bottom bonding surface of the inner terminal lead and the extended, outer terminal lead;
- a second wire bonding the intermediary terminal to the semiconductor die;
- and
- a trace interconnecting the intermediary terminal to the extended, outer terminal lead.
Dependencies are inferred from the claim text.