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US 8,044,495 B2Granted
Metallic leadframes having laser-treated surfaces for improved adhesion to polymeric compounds
AssigneeTexas Instruments Incorporated
InventorDonald C Abbott
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Abstract
A leadframe for the assembly of a semiconductor chip has regions (112) with an original smooth surface of glossy appearance and regions (113, 114, 210) of a frosty appearance with rough surface contours. The regions of rough surface contours include two-dimensional arrays of spots (401) comprising a central area (402) below the original surface (400) and a piled ring (403) above the original surface. The piled ring (403) consists of the leadframe material in amorphous configuration.
Claims15
An apparatus comprising:
- a lead frame having a chip pad and lead segments and arrays of spots on the chip pad and the lead segments, each spot comprising a circular recessed portion and a piled ring of metallic material above and around the recessed portion.
An apparatus, comprising:
- a semiconductor chip affixed on a lead frame;
- a mold compound encapsulating the semiconductor chip;
- lead segments exposed from the encapsulation at edges of the apparatus;
- arrays of spots on the lead segments near where the lead segments are exposed from the encapsulation;
- and
- each spot comprising a circular recessed portion and a piled ring of metallic material above and around the recessed portion.
3 more elements
Dependencies are inferred from the claim text.