Photo detector and optically interconnected LSI
AssigneeKabushiki Kaisha Toshiba
InventorHideto Furuyama
Life of this patent
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Abstract
A photo detector having an electrically conductive thin film and a light-receiving unit. A coupling periodic structure is provided on a surface of the film and converts incidence light to surface plasmon. The coupling periodic structure has an opening that penetrates the obverse and reverse surfaces of the thin film. The light-receiving unit is provided at one end of the opening in the surface that is opposite to the surface on which the coupling periodic structure is provided. The opening is shaped like a slit and is broader than half (½) the wavelength of the surface plasmon in a direction that intersects at right angles with a polarization direction of the incidence light and is narrower than half (½) the wavelength of the surface plasmon in a direction parallel to the polarization direction.
Claims7
An optically interconnected LSI comprising:
- a semiconductor substrate which has a main surface;
- a transistor unit configured to be integrally formed on the main surface of the semiconductor substrate;
- a multilayer-interconnection structure unit which is provided on the transistor unit;
- an electrically conductive thin film which is provided on the multilayer-interconnection structure unit and has an upper surface, a lower surface, a coupling periodic structure formed on the upper surface, and an opening penetrating the upper surface and the lower surface, the opening being formed of a slit having a length longer than half a wavelength of a surface plasmon converted from incident light in a direction that intersects at a right angle with a polarization direction of the incident light and a width narrower than half the wavelength of the surface plasmon in a direction that is parallel to the polarization direction;
- an electrically conductive pillar having upper and lower surfaces and configured to penetrate the upper and lower surfaces of the multilayer-interconnection structure unit and has a waveguide opening penetrating the upper and lower surfaces of the electrically conductive pillar, an end of the waveguide opening communicating with the opening of the electrically conductive thin film;
- and
- a semiconductor light-receiving unit which is provided on the surface of the semiconductor substrate and located at the other end of the waveguide opening of the electrically conductive pillar.
Dependencies are inferred from the claim text.