Semiconductor device and method of manufacturing the same

A semiconductor device comprising:

• a semiconductor substrate having a front surface which comprises a first region and a second region that is separated from the first region;
• a light receiving portion disposed on the front surface in the first region;
• a light emitting portion disposed on the front surface in the second region;
• an insulation film covering the front surface of the semiconductor substrate;
• an electrode disposed on the insulation film;
• a supporting body attached to the front surface of the semiconductor substrate;
• an adhesive layer comprising an organic resin and attaching the supporting body to the front surface so as to cover the insulation film and the electrode;
• and
• a bump electrode disposed on a back surface of the semiconductor substrate and electrically connected to the electrode,
• wherein a first opening is formed to penetrate the supporting body and the adhesive layer so as to expose the light receiving portion,
• a second opening is formed to penetrate the supporting body and the adhesive layer so as to expose the light emitting portion, and
• the first opening is different from the second opening.