Leadframe-based packages for solid state light emitting devices

A modular package for a light emitting device, comprising:

• a leadframe including a central body including a first region having a top surface, a bottom surface and a first thickness and a second region having a top surface, a bottom surface and a second thickness that is less than the first thickness, the leadframe further including a plurality of electrical leads extending laterally away from the second region, wherein the plurality of electrical leads are electrically isolated from the second region;
• and
• a thermoset package body on the leadframe and surrounding the first region, wherein thermoset package body is on the top and bottom surfaces of the second region and extends between the second region and the plurality of electrical leads, and wherein the thermoset package body forms a hermetic bond to the leadframe.