Package for a light emitting element
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsThomas Murphy, Andreas A. Hase, Matthias Heschel
Life of this patent
Estimating the term…
Abstract
A high-brightness LED module includes a substrate with a recess in which a light emitting element is mounted. The recess is defined by a sidewalls and a relatively thin membrane. At least two micro-vias are provided in the membrane and include conductive material that passes through the membrane. A p-contact of the light emitting element is coupled to a first micro-via and an n-contact of the light emitting element is coupled to a second micro-via.
Claims55
An LED package comprising:
- an LED chip having an optically active layer on a substrate;
- a platform, formed by a supporting frame surrounding a recessed membrane on which the LED chip is mounted in close thermal contact to the material of the platform, wherein the membrane is provided with one or more electrically isolated through-contacts made from electrically conducting material and connected to respective electrodes of the LED chip, wherein the LED chip has a side length dimension E, a thickness of the membrane is less than 3/10 the LED chip dimension (E) and a thickness of the supporting frame is more than twice the membrane thickness.
An LED package, comprising;
- an LED chip having an optically active layer on a substrate;
- a submount comprising a central recessed membrane, wherein the LED chip is mounted on the membrane in close thermal contact to the material of the submount, the thickness of the membrane being less than 100 microns and the thickness of a frame of the submount, which is integrally formed with the membrane, is substantially larger than the thickness of the membrane.
An LED package comprising;
- an LED chip having an optically active layer on a substrate, a submount comprising a central recessed membrane, wherein the LED chip is mounted to the membrane in close thermal contact to the material of the submount, the thickness of the membrane being less than 100 microns and the thickness of a frame of the submount which is integrally formed with the membrane, is substantially larger than the thickness of the membrane, wherein the submount is made from silicon.
An LED package, comprising;
- an LED chip having an optically active layer on a substrate, a submount comprising a central recessed membrane, wherein the LED chip is mounted to the membrane in close thermal contact to the material of the submount, the thickness of the membrane being less than 100 microns and the thickness of a frame of the submount, which is integrally formed with the membrane, is substantially larger than the thickness of the membrane, wherein the membrane comprises at least one through-hole filled with electrically conducting material electrically connected to an electrode of the LED chip.
A light emitting device package comprising:
- a substrate including a platform portion surrounded by a supporting frame portion;
- a recess disposed in the substrate, wherein the platform portion forms a bottom portion of the recess;
- a light emitting device chip disposed on the platform portion of the substrate, such that the light emitting chip is in thermal contact with the platform portion, wherein the light emitting device chip has a dimension E and a thickness of the platform portion is less than 3/10 the light emitting device chip dimension E and a thickness of the supporting frame portion is more than twice the platform portion thickness;
- and
- one or more electrically isolated through-contacts disposed in the platform portion made from electrically conducting material and connected to respective electrodes of the light emitting device chip.
Dependencies are inferred from the claim text.