III-nitride based semiconductor structure with multiple conductive tunneling layer
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChia-Lin Yu, Ding-Yuan Chen, Chen-Hua Yu, Wen-Chih Chiou
Life of this patent
Estimating the term…
Loading patent…
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChia-Lin Yu, Ding-Yuan Chen, Chen-Hua Yu, Wen-Chih Chiou
Estimating the term…
A semiconductor structure includes a substrate and a conductive carrier-tunneling layer over and contacting the substrate. The conductive carrier-tunneling layer includes first group-III nitride (III-nitride) layers having a first bandgap, wherein the first III-nitride layers have a thickness less than about 5 nm; and second III-nitride layers having a second bandgap lower than the first bandgap, wherein the first III-nitride layers and the second III-nitride layers are stacked in an alternating pattern. The semiconductor structure is free from a III-nitride layer between the substrate and the conductive carrier-tunneling layer. The semiconductor structure further includes an active layer over the conductive carrier-tunneling layer.
A semiconductor structure comprising:
A semiconductor structure comprising:
A semiconductor structure comprising:
Dependencies are inferred from the claim text.