Semiconductor device having light emitting element, integrated circuit and adhesive layer
AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorsToru Takayama, Junya Maruyama, Yumiko Ohno
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Abstract
To realize a high-performance liquid crystal display device or light-emitting element using a plastic film. A CPU is formed over a first glass substrate and then, separated from the first substrate. A pixel portion having a light-emitting element is formed over a second glass substrate, and then, separated from the second substrate. The both are bonded to each other. Therefore, high integration can be achieved. Further, in this case, the separated layer including the CPU serves also as a sealing layer of the light-emitting element.
Claims12
A semiconductor device comprising:
- a pixel portion and a driver circuit formed over a first substrate,
- the pixel portion comprising:
- a first thin film transistor formed over the first substrate;
- a first electrode formed over and connected to the first thin film transistor;
- an EL layer formed over the first electrode;
- and
- a second electrode formed over the EL layer;
- the driver circuit being capable of driving the pixel portion comprising:
- a second thin film transistor over the first substrate;
- a semiconductor integrated circuit comprising a third thin film transistor and formed below a second substrate;
- and
- a sealing material formed between the first substrate and the second substrate,
- wherein the semiconductor integrated circuit overlaps with the driver circuit, and
- wherein the semiconductor integrated circuit is not overlapped with the pixel portion.
A semiconductor device comprising:
- a pixel portion and a driver circuit formed over a first substrate,
- the pixel portion comprising:
- a first thin film transistor formed over the first substrate;
- a first electrode formed over and connected to the first thin film transistor;
- an EL layer formed over the first electrode;
- and
- a second electrode formed over the EL layer;
- the driver circuit being capable of driving the pixel portion comprising:
- a second thin film transistor over the first substrate;
- a semiconductor integrated circuit comprising a third thin film transistor and formed below a second substrate;
- a sealing material formed between the first substrate and the second substrate;
- and
- an adhesive material being in contact with the pixel portion, the driver circuit, the semiconductor integrated circuit and the sealing material,
- wherein the semiconductor integrated circuit overlaps with the driver circuit, and
- wherein the semiconductor integrated circuit is not overlapped with the pixel portion.
Dependencies are inferred from the claim text.