Method and apparatus for the correction of defective solder bump arrays
OwnerEnrico Herz, Michael Teich +1inventors
InventorsEnrico Herz, Michael Teich, Axel Becker
Life of this patent
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Abstract
Disclosed is a method and apparatus for the correction of defective solder bump arrays arranged in a plurality of cavities in a mold. In the method, a faulty solder bump is searched, identified and located (i.e., its position is determined) in an arrangement of solder bumps disposed in cavities of a mold and the faulty solder bump is subsequently replaced by a prefabricated solder bump. The apparatus for carrying out the method comprises a mold holder, a scanning and locating device for finding and locating faulty solder bumps and a repair device for replacing the faulty solder bump by a prefabricated solder bump.
Claims17
A method for correcting a defective arrangement of solder bumps located in cavities of a mold comprising:
- searching, identifying and locating a missing solder bump missing from said arrangement, and subsequently replacing the missing solder bump with a prefabricated solder bump, wherein said replacing comprises removing the prefabricated solder bump from a deposit cavity arranged in an edge region of the mold and transporting the prefabricated solder bump to the cavity of the missing solder bump and inserting the prefabricated solder bump into said cavity, and wherein the prefabricated solder bump is released from the deposit cavity by a targeted energy beam being pointed to the deposit cavity from a bottom of the mold and is dosed such that material of the prefabricated solder bump melts at a border surface to the deposit cavity and the prefabricated solder bump separates from the deposit cavity and subsequently the separated prefabricated solder bump is lifted off the deposit cavity.
A method for correcting a defective arrangement of solder bumps located in cavities of a mold comprising:
- searching, identifying and locating a missing solder bump missing from said arrangement, and subsequently replacing the missing solder bump with a prefabricated solder bump, wherein said replacing comprises removing the prefabricated solder bump from a deposit cavity arranged in an edge region of the mold and transporting the prefabricated solder bump to the cavity of the missing solder bump and inserting the prefabricated solder bump into said cavity, wherein the prefabricated solder bump is removed from the deposit cavity by pointing a targeted energy beam from a bottom of the mold to the deposit cavity, dosed such that material of the prefabricated solder bump evaporates at a border surface to the deposit cavity and a developing vapor layer ejects the prefabricated solder bump from the deposit cavity.
A method for correcting a defective arrangement of solder bumps located in cavities of a mold comprising:
- searching, identifying and locating a missing solder bump missing from said arrangement, and subsequently replacing the missing solder bump with a prefabricated solder bump, wherein said replacing comprises removing the prefabricated solder bump from a deposit cavity arranged in an edge region of the mold and transporting the prefabricated solder bump to the cavity of the missing solder bump and inserting the prefabricated solder bump into said cavity, wherein the prefabricated solder bump is fixed in the cavity of the missing solder bump by a targeted energy beam being pointed from a bottom of the mold to the cavity and dosed such that material of the prefabricated solder bump melts at a bordering surface to the cavity and adheres the prefabricated solder bump to the cavity.
A device for correcting a defective arrangement of solder bumps located in cavities of a mold comprising:
- a mold carrier, an identification and locating device for finding and locating a missing solder bump, missing from said arrangement;
- a repair device for accepting, transporting, and inserting a prefabricated solder bump from a deposit cavity in an edge region of the mold into a cavity of the missing solder bump, and a release device employing a targeted energy beam directed at the deposit cavity from bottom of the mold to release the prefabricated solder bump from the deposit cavity.
Dependencies are inferred from the claim text.