Wiring board and method of manufacturing the same

A wiring board comprising:

• a base substrate having a conductive pattern formed on an upper surface of the base substrate and a conductive pattern formed on a lower surface of the base substrate;
• a first upper-layer insulation layer formed on the upper surface of the base substrate and the conductive pattern formed on the upper surface of the base substrate, the first upper-layer insulation layer having a conductive pattern formed thereon and comprising a resin-impregnated inorganic cloth;
• a first lower-layer insulation layer formed on the lower surface of the base substrate and the conductive pattern formed on the lower surface of the base substrate, the first lower-layer insulation layer having a conductive pattern formed thereon and comprising a resin-impregnated inorganic cloth;
• a via formed in the first upper-layer insulation layer and connecting the conductive pattern formed on the upper surface of the base substrate and the conductive pattern formed on the first upper-layer insulation layer;
• a via formed in the first lower-layer insulation layer and connecting the conductive pattern formed on the lower surface of the base substrate and the conductive pattern formed underneath the first lower-layer insulation layer;
• and
• a through-hole comprising a plating film and a resin filling an interior space surrounded by the plating film of the through-hole, the plating film of the through-hole being connected to the conductive pattern formed on the upper surface of the base substrate and the conductive pattern formed on the lower surface of the base substrate,
• wherein through-hole is penetrating through the base substrate and covered with the insulation layer, and the through-hole has an aspect ratio in a range of 2 to 5 and a hole-diameter in a range of 10 μm to 150μm.

A method of manufacturing a wiring board, comprising:

• providing in a base substrate having a conductive pattern on a surface of the base substrate;
• forming a through-hole comprising a plating film and penetrating through the base substrate such that the plating film of the through-hole is connected to the conductive pattern on the surface of the base substrate and has an aspect ratio in a range of 2 to 5 and a hole-diameter in a range of 10 μm to 150 μm;
• laminating on the base substrate an insulation layer comprising a resin-impregnated inorganic cloth such that a resin of the insulation layer fills an interior space surrounded by the plating film of the through-hole;
• forming a conductive pattern on a surface of the insulation layer;
• and
• forming in the insulation layer a via connecting the conductive pattern formed on the surface of the insulation layer and the conductive pattern formed on the surface of the base substrate.

A method of manufacturing a wiring board, comprising:

• providing a base substrate having a conductive pattern on an upper surface of the base substrate and a conductive pattern on a lower surface of the base substrate;
• forming a through-hole comprising a plating film and penetrating through the base substrate such that the plating film of the through-hole is connected to the conductive pattern on the upper surface of the base substrate and the conductive pattern on the lower surface of the base substrate and has an aspect ratio in a range of 2 to 5 and a hole-diameter in a range of 10 μm to 150 μm;
• laminating on the upper surface of the base substrate a first upper-layer insulation layer comprising a resin-impregnated inorganic cloth;
• forming a conductive pattern on a surface of the first insulation layer;
• laminating on the lower surface of the base substrate a first lower-layer insulation layer comprising a resin-impregnated inorganic cloth;
• forming a conductive pattern on a surface of the first lower-layer insulation layer;
• forming in the first upper-layer insulation layer a via connecting the conductive pattern formed on the first upper-layer insulation layer and the conductive pattern formed on the uuper surface of the base substrate;
• and
• forming in the first lower-layer insulation layer a via connecting the conductive pattern formed underneath the first lower-layer insulation layer and the conductive pattern formed on the lower surface of the base substrate,
• wherein at least one of the laminating of the first upper-layer insulation layer and the laminating of the first lower-layer insulation layer comprises filling a resin into an interior space surrounded by the plating film of the through-hole.