US 8,044,305 B2 · Circuit board including hybrid via structures

Abstract

A circuit board may include hybrid via structures configured to connect to components, such as connectors and electronic components, mounted on the circuit board. A hybrid via structure may include one or more micro-vias configured to provide an electrical connection to a signal trace in the circuit board and one or more through-vias configured to provide a ground connection to at least one reference plane in the circuit board. In one embodiment, a plurality of circuit boards including the hybrid via structures and signal traces may be connected to establish a channel supporting differential signaling and data transfer rates of at least about 5 Gb/s. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Claims14

Dependent claims

A system comprising:

at least one circuit board comprising:
a plurality of circuit board layers including a plurality of signal layers and at least one reference layer;
at least one signal trace located within said at least one of said signal layers;
and
at least one hybrid via structure located in said circuit board, said hybrid via structure comprising at least one through-via electrically connected to said at least one reference layer and at least one micro-via electrically connected to said signal trace;
and
at least one component connected to said circuit board, said component comprising at least one grounding pin extending into and electrically connected with said at least one through-via and at least one signal pad contacting and electrically connected to said at least one micro-via.

4 more elements

Dependencies are inferred from the claim text.

Circuit board including hybrid via structures

Life of this patent

Circuit board including hybrid via structures

Life of this patent

Abstract

Claims14