White heat-curable silicone/epoxy hybrid resin composition for optoelectronic use, making method, premolded package, and LED device
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsJunichi Sawada, Yusuke Taguchi
Life of this patent
Estimating the term…
Abstract
A white heat-curable silicone/epoxy hybrid resin composition is provided comprising (A) a heat-curable silicone resin, (B) a triazine derived epoxy resin composition, (C) a white pigment, (D) an inorganic filler, and (E) an antioxidant. Antioxidant (E) is a phosphite compound having formula: P(OR1)(OR2)2 wherein R1 and R2 are organic groups of at least 6 carbon atoms. Components (A) and (B) are present in a weight ratio of from 5:95 to 95:5. The composition effectively cures into a product maintaining heat resistance, light resistance and improved strength over a long term.
Claims14
A white heat-curable silicone/epoxy hybrid resin composition for optoelectronic devices, comprising:
- (A) a heat-curable silicone resin which has the average compositional formula (2):
- R3aSi(OR4)b(OH)cO(4−a−b−c)/2 (2)
- wherein R3 is each independently an organic group of 1 to 20 carbon atoms, R4 is each independently an organic group of 1 to 4 carbon atoms, a, b and c are numbers in the range:
- 0.8≦a≦1.5, 0≦b≦0.3, 0.001≦c≦0.5, and 0.801≦a+b+c<2,
- (B) a triazine derived epoxy resin composition,
- (C) a white pigment,
- (D) an inorganic filler excluding the white pigment, and
- (E) an antioxidant, wherein said antioxidant (E) is a phosphite compound having the general formula (1):
- P(OR1)(OR2)2 (1)
- wherein R1 and R2 are each independently an organic group of at least 6 carbon atoms, and components (A) and (B) are present in a weight ratio of from 5:95 to 95:5.
A method for preparing a white heat-curable silicone/epoxy hybrid resin composition for optoelectronic devices, comprising the steps of:
- providing (B) a triazine derived epoxy resin composition by combining (B-1) a triazine derived epoxy resin with (B-2) an acid anhydride in such amounts as to provide an epoxy group equivalent to acid anhydride group equivalent ratio between 0.6 and 2.0, reacting them to form a solid product, and grinding the solid product,
- mixing (A) a heat-curable silicone resin with the triazine derived epoxy resin composition (B) in a weight ratio of from 5:95 to 95:5, and
- concurrently mixing them with (C) a white pigment, (D) an inorganic filler excluding the white pigment, and (E) an antioxidant, said antioxidant (E) being a phosphite compound having the general formula (1):
- P(OR1)(OR2)2 (1)
- wherein R1and R2 are each independently an organic group of at least 6 carbon atoms.
A method for preparing a white heat-curable silicone/epoxy hybrid resin composition for optoelectronic devices, comprising the steps of:
- providing (B) a triazine derived epoxy resin composition by combining (B-1) a triazine derived epoxy resin with (B-2) an acid anhydride in such amounts as to provide an epoxy group equivalent to acid anhydride group equivalent ratio between 0.6 and 2.0 in the presence of (E) an antioxidant, reacting them to form a solid product, and grinding the solid product, said antioxidant (E) being a phosphite compound having the general formula (1):
- P(OR1)(OR2)2 (1)
- wherein R1and R2 are each independently an organic group of at least 6 carbon atoms,
- mixing the resulting mixture of the triazine derived epoxy resin composition (B) and the antioxidant (E) with (A) a heat-curable silicone resin in such amounts as to provide a weight ratio of component (A) to component (B) in the range from 5:95 to 95:5, and
- concurrently mixing them with (C) a white pigment, and (D) an inorganic filler.
A method for preparing a white heat-curable silicone/epoxy hybrid resin composition for optoelectronic devices, comprising the steps of:
- providing (B) a triazine derived epoxy resin composition by combining (B-1) a triazine derived epoxy resin with (B-2) an acid anhydride in such amounts as to provide an epoxy group equivalent to acid anhydride group equivalent ratio between 0.6 and 2.0 in the presence of (F) a curing promoter or (F) the curing promoter and (E) an antioxidant, reacting them to form a solid product, and grinding the solid product, said antioxidant (E) being a phosphite compound having formula (1):
- P(OR1)(OR2)2 (1)
- wherein R1and R2 are each independently an organic group of at least 6 carbon atoms,
- mixing the resulting mixture of the triazine derived epoxy resin composition (B) and the curing promoter (F) or the curing promoter (F) and the antioxidant (E) with (A) a heat-curable silicone resin in such amounts as to provide a weight ratio of component (A) to component (B) in the range from 5:95 to 95:5, and
- concurrently mixing them with (C) a white pigment, (D) an inorganic filler, and component (E) if it has not been used in the reaction.
A premolded package obtained by molding a white heat-curable silicone/epoxy hybrid resin composition for optoelectronic devices, comprising
- (A) a heat-curable silicone resin which has the average compositional formula (2):
- R3aSi(OR4)b(OH)cO(4−a−b−c)/2 (2)
- wherein R3 is each independently an organic group of 1 to 20 carbon atoms, R4 is each independently an organic group of 1 to 4 carbon atoms, a, b and c are numbers in the range:
- 0.8≦a≦1.5, 0≦b≦0.3, 0.001≦c≦0.5, and 0.801≦a+b+c<2,
- (B) a triazine derived epoxy resin composition,
- (C) a white pigment,
- (D) an inorganic filler excluding the white pigment, and
- (E) an antioxidant, wherein
- said antioxidant (E) is a phosphite compound having the general formula (1):
- P(OR1)(OR2)2 (1)
- wherein R1and R2 are each independently an organic group of at least 6 carbon atoms, and components (A) and (B) are present in a weight ratio of from 5:95 to 95:5.
Dependencies are inferred from the claim text.