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US 8,043,961 B2Granted
Method of forming a bond pad
AssigneeMicron Technology, Inc.
InventorsJohn Moore, Joseph F. Brooks
Life of this patent
Estimating the term…
Abstract
A front-end method of fabricating nickel plated caps over copper bond pads used in a memory device. The method provides protection of the bond pads from an oxidizing atmosphere without exposing sensitive structures in the memory device to the copper during fabrication.
Claims17
A method of forming a bond pad comprising:
- forming integrated circuitry on a substrate;
- forming at least one dielectric layer over said integrated circuitry;
- removing at least part of said dielectric layer;
- forming said bond pad in an area where said dielectric layer was removed;
- forming an oxide layer over said at least one dielectric layer and said bond pad;
- removing the oxide layer in an area over the bond pad;
- plating the bond pad with nickel;
- and
- after plating the bond pad with nickel, removing a remainder of said oxide layer.
6 more elements
A method of forming a device having a bond pad, said method comprising:
- forming a bond pad in an area of a dielectric material;
- forming an oxide layer over said dielectric layer and said bond pad;
- removing the oxide layer in an area over the bond pad;
- plating the bond pad with nickel;
- and
- after said step of plating the bond pad with nickel, depositing a cell material over said dielectric layer.
3 more elements
A method of forming a device having a bond pad, said method comprising:
- forming a bond pad in an area of a dielectric material;
- forming an oxide layer over said dielectric layer and said bond pad;
- removing the oxide layer in an area over the bond pad;
- plating the bond pad with nickel;
- and
- after said step of plating the bond pad with nickel, removing a remainder of said oxide layer.
3 more elements
Dependencies are inferred from the claim text.