Laser processing method and chip
AssigneeHamamatsu Photonics K.K.
InventorsRyuji Sugiura, Takeshi Sakamoto
Life of this patent
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Abstract
An object to be processed can be cut highly accurately along a line to cut. An object to be processed 1 is irradiated with laser light while locating a converging point within a silicon wafer 11, and the converging point is relatively moved along a line to cut 5, so as to form modified regions M1, M2 positioned within the object 1 along the line to cut 5, and then a modified region M3 positioned between the modified regions M1, M2 within the object 1.
Claims16
A laser processing method of irradiating a planar object to be processed, wherein the planar object comprises an unilateral surface and an opposing lateral surface to the unilateral surface with laser light while locating a converging point within the object, so as to form a modified region to become a cutting start point within the object along a line to cut in the object, the method comprising the steps of:
- the laser light is incident from the unilateral surface, forming first and second modified regions, arranged in a row in a thickness direction of the object, along the line to cut;
- and
- irradiating the laser light from the unilateral surface to pass though either the first or second modified regions after the procedure of forming the first and second modified regions, forming a third modified region, positioned between the first and second modified regions, along the line to cut.
Dependencies are inferred from the claim text.