Printable semiconductor structures and related methods of making and assembling

A method of transferring a printable semiconductor element to a transfer device, said method comprising the steps of:

• providing a printable semiconductor structure comprising a printable semiconductor element;
• and at least one bridge element connected to said printable semiconductor element and connected to a mother wafer, wherein said printable semiconductor element and said bridge element are at least partially undercut from said mother wafer;
• contacting said printable semiconductor element with a transfer device having a contact surface, wherein contact between said contact surface and said printable semiconductor element binds said printable semiconductor element to said contact surface;
• moving said transfer device in a manner resulting in the fracture said bridge element, thereby transferring said printable semiconductor element from said mother wafer to said transfer device.

A method for assembling a printable semiconductor element on a receiving surface of a substrate, said method comprising the steps of:

• providing a printable semiconductor element;
• and a first bridge element connected to said printable semiconductor element and connected to a mother wafer, wherein said printable semiconductor element and said first bridge element are at least partially undercut from said mother wafer;
• contacting said printable semiconductor element with a conformable transfer device having a contact surface, wherein contact between said contact surface and said printable semiconductor element binds said printable semiconductor element to said contact surface;
• moving said conformable transfer device in a manner resulting in the fracture said first bridge element, thereby transferring said printable semiconductor element from said mother wafer to said conformable transfer device, thereby forming said contact surface having said printable semiconductor element disposed thereon;
• contacting said printable semiconductor element disposed on said contact surface with said receiving surface of said substrate;
• and
• separating said contact surface of said conformable transfer device and said printable semiconductor element, wherein said printable semiconductor element is transferred onto said receiving surface, thereby assembling said printable semiconductor element on said receiving surface of said substrate.