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AssigneeD2S, Inc.
InventorsAkira Fujimura, Michael Tucker
Estimating the term…
In the field of semiconductor production using shaped charged particle beam lithography, a method and system for fracturing or mask data preparation or proximity effect correction is disclosed, wherein a series of curvilinear character projection shots are determined for a charged particle beam writer system, such that the set of shots can form a continuous track, possibly of varying width, on a surface. A method for forming a continuous track on a surface using a series of curvilinear character projection shots is also disclosed. Methods for manufacturing a reticle and for manufacturing a substrate such as a silicon wafer by forming a continuous track on a surface using a series of curvilinear character projection shots is also disclosed.
A method for fracturing or mask data preparation or proximity effect correction for character projection (CP) charged particle beam lithography comprising:
A method for forming a set of patterns on a surface comprising:
A method for manufacturing a semiconductor device on a substrate comprising:
A system for fracturing or mask data preparation or proximity effect correction for use with shaped beam charged particle beam lithography comprising:
Dependencies are inferred from the claim text.