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AssigneeFuji Electric Co., Ltd.
InventorsYouichi Tei, Akira Iso, Kazuhito Higuchi, Hajime Kurihara, Hiroyuki Uwazumi
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An object of the present invention is to provide a plating method on a glass base plate. The method allows forming a plating film on a base plate composed of a glass material with excellent adhesivity and homogeneity by means of an electroless plating method even to a thickness of 1 μm or more. Before forming a plating film by a step of electroless plating S6, a surface treatment process is conducted on a surface of the base plate composed of a glass material. The surface treatment process comprises at least a step of glass activation treatment S2 to increase quantity of silanol groups on the surface of the base plate at least by a factor of two using an aqueous solution of diluted acid, a step of silane coupling agent treatment S3, a step of palladium catalyst treatment S4, and a step of palladium bonding treatment S5.
A method of electroless plating on a glass base plate, the method comprising a series of treatments on a surface of a base plate composed of a glass material, the series of treatments including, in order, at least:
Dependencies are inferred from the claim text.