Integrated inertial measurement system and methods of constructing the same

An inertial measurement system comprising:

• a) a base structure with three mutually orthogonal sides and a bottom surface surrounding a hollow core, the bottom surface having an aperture providing access to the hollow core and forming a junction with each of the three mutually orthogonal sides;
• b) a circuit card assembly mounted on an exterior surface of each side, the circuit card assembly including a gyroscopic rotational rate sensor and a linear accelerometer connected to a circuit board;
• c) a plurality of metallization elements bridging each of the junctions, the metallization elements comprising a plurality of discrete metallic traces that wrap around the edges of the base structure such that each one of the traces extends from one of the three mutually orthogonal sides, across the corresponding junction, and onto the bottom surface;
• d) wherein the bottom surface of the base structure is mounted to a support circuit board such that the plurality of discrete metallic traces engages with both the circuit card assembly and the support circuit board, and conductively connects the circuit card assembly to the support circuit board without the use of lead wires.

An inertial measurement system comprising:

• a) a base structure with three mutually orthogonal sides and a bottom surface surrounding a hollow core, the bottom surface having an aperture providing access to the hollow core, the bottom surface of the base structure being mounted on a support circuit board;
• b) a circuit card assembly mounted on an exterior surface of each side, the circuit card assembly including a plurality of microelectromechanical components mounted directly to the circuit card assembly;
• c) a plurality of metallization elements extending from the bottom surface to the sides of the base structure for conductively connecting the circuit card assembly to a motherboard;
• d) wherein each of the metallization elements comprises a discrete metallic trace that wraps around the edges of the base structure such that each one of the traces extends from one of the three mutually orthogonal sides and onto the bottom surface such that the plurality of discrete metallic traces engages with both the circuit card assembly and the support circuit board, and conductively connects the circuit card assembly to the support circuit board without the use of lead wires.