System for manufacturing a modularly structured apparatus for determining filling level

A kit for assembling an assemblable modularly structured filling level measurement apparatus, comprising:

• a plurality of filling level sensor units including a first sensor unit and a second sensor unit, the first sensor unit configurable to detect a specified physical measurement quantity and to convert the measurement quantity into an electrical measurement signal, the first and second sensor units being based on different measuring principles;
• at least one evaluation unit configurable to evaluate and generate, based on the electrical measuring signal, a process quantity signal representing a physical measurement quantity detectable by any one of the filling level sensor units, the evaluation unit being configured and standardized to be connectable to any one of the filling level sensor units;
• at least one output unit configurable to output the process quantity signal, the output unit being configured and standardized to be connectable to the at least one evaluation unit;
• at least one voltage supply unit configurable to supply voltage to the assemblable apparatus, the voltage supply unit being configured and standardized to supply voltage to any one of assemblable versions of the modular apparatus;
• at least one housing unit configured and standardized to accommodate at least one unit from the group of units including the evaluation unit, the output unit and the voltage supply unit;
• and
• a plurality of different attachment units configurable to attach the assemblable apparatus to one of vessels and wall portions thereof, each of the attachment units being adapted to fit different ones of one of the vessels and the wall portions,
• wherein the kit is capable of being assembled to form different versions of the measurement apparatus having different ones of the filling level sensor units, and
• wherein different measuring principles are selectable from the group consisting of:
• (a) delay measurement of one of freely radiated waves and guided waves reflected on a filling matter, the waves including one of electromagnetic waves and ultrasonic waves, (b) measurement of a capacitance of a filling matter, (c) measurement of one of a pressure and a differential pressure, (d) limit level measurement using of vibration in a conductive way, and (e) temperature measurement.