Method of manufacturing ink jet recording head
AssigneeSeiko Epson Corporation
InventorKei Kanemoto
Life of this patent
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Abstract
A method is provided for manufacturing an ink jet recording head including a reservoir to which ink is supplied from outside, a pressure generating chamber leading to the reservoir, and a nozzle orifice leading to the pressure generating chamber. According to the method, the ink jet recoding head is fabricated by conducting semiconductor processes such as a film forming step, a photolithography step, an etching step and the like, on a single substrate. Thus, there is no need for multiple substrates or adhesives.
Claims6
A method for manufacturing an ink jet recording head including a reservoir to which ink is supplied from outside, a pressure generating chamber leading to the reservoir, and a nozzle orifice leading to the pressure generating chamber, the method comprising:
- a) forming a flow channel forming film on a first face side of a substrate having an integrated circuit;
- b) forming a groove in the flow channel forming film;
- c) filling the groove with a sacrificial film;
- d) forming a vibrating film on the sacrificial film and the flow channel forming film;
- e) forming a piezoelectric element on the vibrating film;
- f) forming the reservoir by etching the substrate from a second face side of the substrate to an extent where the sacrificial film is exposed;
- g) removing the sacrificial film through the reservoir;
- and
- h) forming the nozzle orifice in the flow channel forming film.
A method for manufacturing an ink jet recording head including a reservoir to which ink is supplied from outside, a pressure generating chamber leading to the reservoir, and a nozzle orifice leading to the pressure generating chamber, the method, comprising:
- a) forming a first flow channel forming film on a first face side of a substrate having an integrated circuit;
- b) forming a first groove in areas of the first flow channel forming film where is going to be a first leading channel that couples the pressure generating chamber and the reservoir, and where is going to be a second leading channel that couples the pressure generating chamber and the nozzle orifice;
- c) filling the first groove with a first sacrificial film;
- d) forming a second flow channel forming film on the first flow channel forming film and the first sacrificial film;
- e) forming a second groove in an area of the second flow channel forming film where is going to be the pressure generating chamber;
- f) filling the second groove with a second sacrificial film;
- g) forming a vibrating film on the second sacrificial film and the second flow channel forming film;
- h) forming a piezoelectric element on the vibrating film;
- i) forming a reservoir by etching the substrate from a second face side of the substrate to an extent where the first sacrificial film is exposed;
- j) removing the first sacrificial film and the second sacrificial film through the reservoir;
- and
- k) forming the nozzle orifice in the second flow channel forming film.
Dependencies are inferred from the claim text.