Manufacturing method of tape carrier for TAB

A manufacturing method of a tape carrier for tape automated bonding (TAB), comprising the steps of:

• forming a long-sized circuit board by forming a plurality of mounting parts each including a wiring pattern on a long-sized insulating layer;
• and
• forming a solder resist in a predetermined region of the wiring pattern in each of the mounting parts for each unit region including a predetermined number of mounting parts of said long-sized circuit board by using a screen printing device while transporting said long-sized circuit board by a roll-to-roll system, the screen printing device including a printing stage set at a back surface of said insulating layer of said long-sized circuit board and a screen plate set at a surface on a side of said plurality of mounting parts of said long-sized circuit board which is opposite to said printing stage, such that said long-sized circuit board is sandwiched between said printing stage and said screen plate, wherein
• said step of forming said long-sized circuit board includes a step of forming a positioning mark, corresponding to each unit region, in a region along at least one lateral side in a longitudinal direction on said long-sized circuit board, the step of forming the positioning mark including providing each positioning mark such that the unit region corresponding to the positioning mark is positioned below said screen plate when the positioning mark is positioned at a predetermined portion of said printing stage in the transportation direction of said long-sized circuit board,
• a region where said screen printing device can make prints is a region below said screen plate, and
• said step of forming the solder resist includes
• a step of detecting that the unit region corresponding to the positioning mark is positioned in a region where said screen printing device can make prints by detection of the positioning mark during transportation of said long-sized circuit board,
• a step of stopping the transportation of said long-sized circuit board in response to said detection of the positioning mark,
• a step of performing screen printing of the solder resist by said screen printing device to said unit region corresponding to the positioning mark in said long-sized circuit board that has been stopped, and
• a step of resuming the transportation of said long-sized circuit board after said screen printing.