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US 8,037,596 B2Granted
Method for manufacturing a wiring board
AssigneeShinko Electric Industries Co., Ltd.
InventorsShigetsugu Muramatsu, Yasuhiko Kusama
Life of this patent
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Abstract
A wiring board includes: an uppermost wiring layer formed on a prescribed number of underlying wiring layers, a portion of the uppermost wiring layer being exposed and used as a pad for connection with a component to be mounted; and an insulation resin layer covering the uppermost wiring layer, wherein the thickness of the portion of the uppermost wiring layer is larger than that of other portions thereof.
Claims6
A method for manufacturing a wiring board, the method comprising:
- forming the uppermost wiring layer on a prescribed number of underlying wiring layers and insulating layers,
- forming an insulation resin layer covering the entire uppermost wiring layer;
- and
- removing a portion of the insulation resin layer by sandblasting until an upper surface of a portion of the uppermost wiring layer is exposed to form a pad, said pad being generally flush with a surface of the insulation resin layer and being adapted to be connected to an electronic component.
1 more element
Dependencies are inferred from the claim text.