US 8,037,594 B2 · Method of forming a flip-chip package

Abstract

Disclosed are thermally conductive plates. Each plate is configured such that a uniform adhesive-filled gap may be achieved between the plate and a heat generating structure when the plate is bonded to the heat generating structure and subjected to a temperature within a predetermined temperature range that causes the heat generating structure to warp. Additionally, this disclosure presents the associated methods of forming the plates and of bonding the plates to a heat generating structure. In one embodiment the plate is curved and modeled to match the curved surface of a heat generating structure within the predetermined temperature range. In another embodiment the plate is a multi-layer conductive structure that is configured to undergo the same warpage under a thermal load as the heat generating structure. Thus, when the plate is bonded with the heat generating structure it is able to achieve and maintain a uniform adhesive-filled gap at any temperature.

Claims14

Dependent claims

A method of forming a flip chip package, said method comprising:

determining a first curvature of a heat generating structure when said heat generating structure bends in response to a predetermined temperature range, said heat generating structure comprising:
a chip carrier;
and
a chip having a first side and a second side opposite said first side, said first side being attached to said chip carrier;
forming a thermally conductive plate with at least a bottom surface having a second curvature, said second curvature matching said first curvature of said heat generating structure when said heat generating structure bends in response to said predetermined temperature range;
and
bonding said bottom surface of said thermally conductive plate to said second side of said chip with an adhesive such that, when said heat generating structure is in said predetermined temperature range, said bottom surface of said thermally conductive plate and said second side of said chip are separated by a uniform gap filled with said adhesive.

4 more elements

A method of forming a flip chip package, said method comprising:

determining a first curvature of a heat generating structure when said heat generating structure bends in response to a predetermined temperature range, said heat generating structure comprising:
a chip carrier;
and
a chip having a first side and a second side opposite said first side, said first side being attached to said chip carrier;
forming a thermally conductive plate with at least a bottom surface having a second curvature, said second curvature matching said first curvature of said heat generating structure when said heat generating structure bends in response to said predetermined temperature range, said predetermined temperature range comprising a predetermined normal operating temperature of said chip;
and
bonding said bottom surface of said thermally conductive plate to said second side of said chip with a thermally conductive adhesive such that, when said heat generating structure is in said predetermined temperature range, said bottom surface of said thermally conductive plate and said second side of said chip are separated by a uniform gap filled with said thermally conductive adhesive.

4 more elements

A method of forming a flip chip package, said method comprising:

determining a first curvature of a heat generating structure when said heat generating structure bends in response to a predetermined temperature range, said heat generating structure comprising:
a chip carrier;
and
a chip having a first side and a second side opposite said first side, said first side being attached to said chip carrier;
forming a thermally conductive plate with at least a bottom surface having a second curvature, said second curvature remaining constant at all times and matching said first curvature of said heat generating structure when said heat generating structure bends in response to said predetermined temperature range;
and
bonding said bottom surface of said thermally conductive plate to said second side of said chip with an adhesive such that when said heat generating structure is in said predetermined temperature range, said bottom surface of said thermally conductive plate and said second side of said chip are separated by a uniform gap filled with said adhesive.

4 more elements

Dependencies are inferred from the claim text.

Method of forming a flip-chip package

Life of this patent

Method of forming a flip-chip package

Life of this patent

Abstract

Claims14