Methods, structures, and devices for reducing operational energy in phase change memory
AssigneeMicron Technology, Inc.
InventorRoy E. Meade
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Abstract
Methods of forming and operating phase change memory devices include adjusting an activation energy barrier between a metastable phase and a stable phase of a phase change material in a memory cell. In some embodiments, the activation energy barrier is adjusted by applying stress to the phase change material in the memory cell. Memory devices include a phase change memory cell and a material, structure, or device for applying stress to the phase change material in the memory cell. In some embodiments, a piezoelectric device may be used to apply stress to the phase change material. In additional embodiments, a material having a thermal expansion coefficient greater than that of the phase change material may be positioned to apply stress to the phase change material.
Claims8
A memory device, comprising:
- a phase change memory cell comprising:
- a first electrode;
- a second electrode;
- and
- a phase change material disposed between the first electrode and the second electrode;
- a piezoelectric device comprising:
- a piezoelectric material;
- and
- a field-generating device for providing an electrical field within the piezoelectric material;
- wherein the piezoelectric material is located and oriented to cause the piezoelectric material to apply a stress to the phase change material when an electrical field is provided within the piezoelectric material by the field-generating device;
- and
- a dielectric material between the piezoelectric material and the phase change material.
Dependencies are inferred from the claim text.