# US 8,031,464 B2 · Ruggedized computer capable of operating in high-temperature environments > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,031,464 B2 - Document ID: US8031464B2 - Status: Granted - Kind: B2 - Application number: 12/555,468 - Filed: 2009-09-08 - Published: 2010-03-11 - Granted: 2011-10-04 - Earliest claimed: 2008-09-08 - Assignees: Intergraph Technologies Company - Inventors: Casey R. Adkins; Charles A. Abare; Andrew J. Ornatowski - Web page: https://patentgrep.com/patent/US8031464B2 ## CPC - G06F 1/182: {with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]} - G06F 1/20: Cooling means - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) ## Abstract Illustrative embodiments of the present invention are directed to a computer that has a housing with walls that form a substantially sealed interior cavity from an exterior environment. The computer includes a plurality of computer components within the interior cavity. The computer also includes at least one heat sink for dissipating thermal energy into the exterior environment. A cooling element is thermally coupled to the heat sink and at least one of the computer components to transfer thermal energy from the computer component into the heat sink and the exterior environment. ## Claims ### Claim 1 A computer comprising: a housing including walls that form a substantially sealed interior cavity from an exterior environment; a plurality of computer components within the interior cavity; at least one block thermally coupled to at least one computer component and a top wall of the housing to transfer thermal energy from the at least one computer component and the at least one block into the top wall and the exterior environment; at least one heat sink located on at least one wall of the housing for dissipating thermal energy into the exterior environment; and at least one pipe thermally coupled to the at least one block and the at least one heat sink to transfer thermal energy from the at least one block and the at least one computer component into the at least one heat sink and the exterior environment. ### Claim 2 (depends on 1) A computer according to claim 1, wherein at least one computer component is thermally coupled to a wall of the housing. ### Claim 3 (depends on 1) A computer according to claim 1, wherein the at least one block is thermally coupled to the wall of the housing via a thermal pad. ### Claim 4 (depends on 1) A computer according to claim 1, wherein the transfer of thermal energy through the at least one pipe occurs at least in part by convection. ### Claim 5 (depends on 1) A computer according to claim 1, wherein the at least one pipe and the at least one block form an interface and the interface includes a thermal compound. ### Claim 6 (depends on 1) A computer according to claim 1, wherein the at least one pipe contains a fluid. ### Claim 7 (depends on 1) A computer according to claim 1, wherein the at least one heat sink is integral to at least one wall of the housing. ### Claim 8 (depends on 1) A computer according to claim 1, wherein the computer meets Grade-A of the United States Military's MIL-S-901D specification for shock. ### Claim 9 (depends on 1) A computer according to claim 1, wherein the computer includes a solid-state hard drive. ### Claim 10 (depends on 1) A computer according to claim 1, wherein the computer contains only solid-state components. ### Claim 11 (depends on 1) A computer according to claim 1, wherein at least a portion of the housing includes a conductive material to protect the plurality of computer components from electromagnetic interference. ### Claim 12 (depends on 1) A computer according to claim 1, wherein the computer meets the United States Military's MIL-S-461E specification for electromagnetic interference. ### Claim 13 (depends on 1) A computer according to claim 1, wherein the computer is configured to operate in an exterior environment with a temperature of 60° Celsius. ### Claim 14 (depends on 1) A computer according to claim 1, wherein the computer configured to operate in an exterior environment with humidity ranging between 10% to 90%. ### Claim 15 (depends on 1) A computer according to claim 1, wherein the interior cavity meets the National Electrical Manufacturers Association's standard type 3S for enclosure types. ### Claim 16 A computer comprising: a housing including walls that form a substantially sealed interior cavity from an exterior environment; a plurality of computer components within the interior cavity; a first means for dissipating thermal energy into the exterior environment through a top wall of the housing, the first means being thermally coupled to at least one computer component and the top wall; a second means for dissipating thermal energy into the exterior environment through at least one of a front wall, a back wall, and a side wall of the housing, the second means being thermally coupled to the at least one computer component and at least one of a front wall, a back wall, and a side wall of the housing. ### Claim 17 (depends on 16) A computer according to claim 16, wherein the first means includes a thermal pad. ### Claim 18 (depends on 16) A computer according to claim 16, wherein the first means and second means have no moving components. ### Claim 19 (depends on 16) A computer according to claim 16, wherein the computer consumes at least 10 W. ### Claim 20 A method comprising: providing a computer including: a housing including walls that form a substantially sealed interior cavity from an exterior environment; a plurality of computer components within the interior cavity; at least one block thermally coupled to at least one computer component and a top wall of the housing to transfer thermal energy from the at least one computer component and the block into the top wall and the exterior environment; at least one heat sink located on at least one wall of the housing for dissipating thermal energy into the exterior environment; and at least one pipe thermally coupled to the block and the at least one heat sink to transfer thermal energy from the at least one block and the at least one computer component into the at least one heat sink and the exterior environment; and operating the computer in an exterior environment with temperatures between 60° and 65° Celsius. ### Claim 21 (depends on 20) A method according to claim 20, further comprising: operating the computer in an exterior environment with humidity between of 80% and 90%. ### Claim 22 (depends on 20) A method according to claim 20, wherein at least one computer component is thermally coupled to a wall of the housing. ### Claim 23 A computer comprising: a housing including walls that form a substantially sealed interior cavity from an exterior environment; a plurality of computer components within the interior cavity; at least one block thermally coupled to at least one computer component; at least one thermal pad thermally coupled to the at least one block and a top wall of the housing to transfer thermal energy from the at least one computer component and the at least one block into the top wall and the exterior environment; at least one heat sink located on at least one wall of the housing for dissipating thermal energy into the exterior environment; and at least one pipe thermally coupled to the at least one block and the at least one heat sink to transfer thermal energy from the at least one block and the at least one computer component into the at least one heat sink and the exterior environment.