Three-dimensional microstructures and methods of formation thereof

A method of forming a three-dimensional microstructure by a sequential build process, comprising:

• forming a plurality of layers over a substrate, wherein the layers comprise at least one of a first material, a second material and a sacrificial material;
• forming a first microstructural element comprising the first material and including a patterned locking portion;
• forming a second microstructural element comprising the second material;
• and
• removing the sacrificial material to form a non-solid volume to which the first microstructural element and/or the second microstructural element are exposed,
• wherein, the patterned locking portion is disposed at least partially through the second microstructural element to mechanically lock the first microstructural element and the second microstructural element.

A three-dimensional microstructure formed by a sequential build process, comprising:

• a first microstructural element formed of a first material;
• a second microstructural element formed of a second material;
• and
• a non-solid volume to which the first microstructural element and/or the second microstructural element are exposed,
• the first microstructural element comprising a patterned locking portion including a reentrant profile and disposed at least partially through the second microstructural element to mechanically lock the first microstructural element and the second microstructural element.

A three-dimensional microstructure formed by a sequential build process, comprising:

• a first microstructural element formed of a first material;
• a second microstructural element formed of a second material;
• and
• a non-solid volume to which the first microstructural element and/or the second microstructural element are exposed,
• the first microstructural element comprising a patterned locking portion disposed at least partially through the second microstructural element to mechanically lock the first microstructural element and the second microstructural element,
• the microstructure including a coaxial transmission line comprising a center conductor, an outer conductor and a dielectric support member for supporting the center conductor, the dielectric support member being the first microstructural element, and the inner conductor and/or the outer conductor being the second microstructural element,
• the dielectric support member comprising a patterned locking portion at opposing ends of the dielectric support member in mechanically locking engagement with opposing surfaces of the outer conductor.

A three-dimensional microstructure formed by a sequential build process, comprising:

• a first microstructural element formed of a first material;
• a second microstructural element formed of a second material;
• and
• a non-solid volume to which the first microstructural element and/or the second microstructural element are exposed,
• the first microstructural element comprising a patterned locking portion disposed at least partially through the second microstructural element to mechanically lock the first microstructural element and the second microstructural element,
• the patterned locking portion comprising an aperture extending at least partially through the first microstructural element and including a reentrant shape.

A three-dimensional microstructure formed by a sequential build process, comprising:

• a first microstructural element formed of a first material;
• a second microstructural element formed of a second material;
• and
• a non-solid volume to which the first microstructural element and/or the second microstructural element are exposed,
• the first microstructural element comprising a patterned locking portion disposed at least partially through the second microstructural element to mechanically lock the first microstructural element and the second microstructural element,
• the patterned locking portion comprising an aperture extending at least partially through the first microstructural element,
• wherein metal material is disposed in the aperture affixing the first microstructural element to the second microstructural element.

A three-dimensional microstructure formed by a sequential build process, comprising:

• a first microstructural element formed of a first material;
• a second microstructural element formed of a second material;
• and
• a non-solid volume to which the first microstructural element and/or the second microstructural element are exposed,
• the first microstructural element comprising a patterned locking portion disposed at least partially through the second microstructural element to mechanically lock the first microstructural element and the second microstructural element,
• the patterned locking portion comprising an aperture extending completely through the first microstructural element from a first surface to a second surface thereof.