ID chip and IC card
AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorShunpei Yamazaki
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Abstract
The present invention provides an ID chip or an IC card in which the mechanical strength of an integrated circuit can be enhanced without suppressing a circuit scale. An ID chip or an IC card of the present invention has an integrated circuit in which a TFT (a thin film transistor) is formed from an insulated thin semiconductor film. Further, an ID chip or an IC card of the present invention has a light-emitting element and a light-receiving element each using a non-single-crystal thin film for a layer conducting photoelectric conversion. Such a light-emitting element or a light-receiving element may be formed consecutively to (integrally with) an integrated circuit or may be formed separately and attached to an integrated circuit.
Claims16
A semiconductor device comprising:
- an antenna;
- an integrated circuit comprising a thin film transistor;
- a light-receiving element configured to receive a signal by optical communication;
- and
- a light-emitting element configured to transmit a signal by optical communication,
- wherein the light-receiving element has a layer for conducting photoelectric conversion using a non-single crystal thin film,
- wherein the light-emitting element has an electroluminescent layer using a non-single crystal thin film,
- wherein the integrated circuit includes a power supply circuit configured to generate a power supply voltage from an alternating voltage generated by the antenna, and
- wherein the antenna, the light-emitting element and the light-receiving element are electrically connected to the integrated circuit on the same substrate.
A semiconductor device comprising:
- an antenna;
- an integrated circuit comprising a thin film transistor;
- a light-receiving element configured to receive a signal by optical communication;
- and
- a light-emitting element configured to transmit a signal by optical communication,
- wherein the antenna, the light-emitting element and the light-receiving element are electrically connected to the integrated circuit,
- wherein the integrated circuit includes a power supply circuit configured to generate a power supply voltage from an alternating voltage generated by the antenna, and
- wherein the integrated circuit, the light-emitting element and the light-receiving element are formed on the same substrate.
A semiconductor device comprising:
- an antenna;
- an integrated circuit comprising a thin film transistor;
- a light-receiving element configured to receive a signal by optical communication;
- and
- a light-emitting element configured to transmit a signal by optical communication,
- wherein the antenna, the light-emitting element and the light-receiving element are electrically connected to the integrated circuit,
- wherein the integrated circuit includes a power supply circuit configured to generate a power supply voltage from an alternating voltage generated by the antenna, and
- wherein the antenna, the integrated circuit, the light-emitting element and the light-receiving element are formed on the same substrate.
A semiconductor device comprising:
- an integrated circuit;
- a light-receiving element configured to receive a signal by optical communication;
- and
- a light-emitting element configured to transmit a signal by optical communication,
- wherein the integrated circuit comprises a connection terminal, a rectification circuit configured to rectify an alternating voltage generated by an antenna, a power supply circuit configured to generate a power supply voltage by using a voltage outputted from the rectification circuit, a demodulation circuit, and a logic circuit, and
- wherein the integrated circuit, the light-emitting element and the light-receiving element are formed on the same substrate.
A semiconductor device comprising:
- an antenna;
- an integrated circuit comprising a thin film transistor;
- a light-receiving element configured to receive a signal by optical communication;
- and
- a light-emitting element configured to transmit a signal by optical communication,
- wherein the light-receiving element has a layer for conducting photoelectric conversion using a non-single crystal thin film,
- wherein the light-emitting element has an electroluminescent layer using a non-single crystal thin film,
- wherein the antenna, the light-emitting element and the light-receiving element are electrically connected to the integrated circuit,
- wherein the integrated circuit, the light-emitting element and the light-receiving element are attached to a substrate with an adhesive agent, and
- wherein the integrated circuit includes a power supply circuit configured to generate a power supply voltage from an alternating voltage generated by the antenna.
A semiconductor device comprising:
- an antenna;
- an integrated circuit comprising a thin film transistor;
- a light-receiving element configured to receive a signal by optical communication;
- and
- a light-emitting element configured to transmit a signal by optical communication,
- wherein the antenna, the light-emitting element and the light-receiving element are electrically connected to the integrated circuit,
- wherein the integrated circuit, the light-emitting element and the light-receiving element are attached to a substrate with an adhesive agent, and
- wherein the integrated circuit includes a power supply circuit configured to generate a power supply voltage from an alternating voltage generated by the antenna.
A semiconductor device comprising:
- an antenna;
- an integrated circuit comprising a thin film transistor;
- a light-receiving element configured to receive a signal by optical communication;
- and
- a light-emitting element configured to transmit a signal by optical communication,
- wherein the antenna, the light-emitting element and the light-receiving element are electrically connected to the integrated circuit,
- wherein the antenna, the integrated circuit, the light-emitting element and the light-receiving element are attached to a substrate with an adhesive agent, and
- wherein the integrated circuit includes a power supply circuit configured to generate a power supply voltage from an alternating voltage generated by the antenna.
A semiconductor device comprising:
- an integrated circuit;
- a light-receiving element configured to receive a signal by optical communication;
- and
- a light-emitting element configured to transmit a signal by optical communication,
- wherein the integrated circuit comprises a connection terminal, a rectification circuit configured to rectify an alternating voltage generated by an antenna, a power supply circuit configured to generate a power supply voltage by using a voltage outputted from the rectification circuit, a demodulation circuit, and a logic circuit,
- wherein the integrated circuit, the light-emitting element and the light-receiving element are formed integrally, and
- wherein the integrated circuit, the light-emitting element and the light-receiving element are attached to a substrate with an adhesive agent.
An IC card comprising:
- an antenna;
- an integrated circuit comprising a thin film transistor;
- a light-receiving element configured to receive a signal by optical communication;
- and
- a light-emitting element configured to transmit a signal by optical communication,
- wherein the antenna, the light-emitting element and the light-receiving element are electrically connected to the integrated circuit,
- wherein the integrated circuit includes a power supply circuit configured to generate a power supply voltage from an alternating voltage generated by the antenna, and
- wherein the integrated circuit, the light-emitting element and the light-receiving element are formed on the same substrate.
An IC card comprising:
- an integrated circuit;
- a light-receiving element configured to receive a signal by optical communication;
- and
- a light-emitting element configured to transmit a signal by optical communication,
- wherein the integrated circuit comprises a connection terminal, a rectification circuit configured to rectify an alternating voltage generated by an antenna, a power supply circuit configured to generate a power supply voltage by using a voltage outputted from the rectification circuit, a demodulation circuit, and a logic circuit, and
- wherein the integrated circuit, the light-emitting element and the light-receiving element are formed on the same substrate.
An IC card comprising:
- an antenna;
- an integrated circuit comprising a thin film transistor;
- a light-receiving element configured to receive a signal by optical communication;
- and
- a light-emitting element configured to transmit a signal by optical communication,
- wherein the antenna, the light-emitting element and the light-receiving element are electrically connected to the integrated circuit,
- wherein the integrated circuit, the light-emitting element and the light-receiving element are attached to a substrate with an adhesive agent,
- wherein the integrated circuit includes a power supply circuit configured to generate a power supply voltage from an alternating voltage generated by the antenna.
Dependencies are inferred from the claim text.