US 8,028,211 B1 · Look-ahead built-in self tests with temperature elevation of functional elements

Abstract

A method and apparatus are disclosed for predicting the failure of a functional element of an integrated circuit during operation. The method includes determining whether the functional element of the integrated circuit device is in an idle cycle, elevating the temperature of the functional element above a normal operating temperature, performing a stress test of the functional element while the functional element is in the idle cycle, and indicating that the functional element, if it fails the stress test, is a potential future failing element. The stress test can include simultaneously providing a margining test voltage and a stress clock signal to the functional element while the temperature is elevated or at a normal operating temperature. The stress test is performed in the background, during continuous operation of the integrated circuit device, such that normal operation of the integrated circuit device is not interrupted. Thereby, the method and apparatus of the present invention allows for failure prediction in a device before it happens, allowing for planned outages or workarounds and avoiding system downtime for unplanned repairs.

Claims27

Dependent claims

A method for identifying a potential future failing functional element in an integrated circuit during normal operation of the integrated circuit, the method comprising:

determining whether the functional element of the integrated circuit is in an idle cycle;
elevating the temperature of the functional element above a normal operating temperature when the functional element is determined to be in the idle cycle;
performing a stress test of the functional element while the temperature of the functional element is at the elevated temperature and the functional element is in the idle cycle;
and
if the functional element fails the stress test, indicating that the functional element is a potential future failing functional element.

2 more elements

An integrated circuit device comprising:

a functional element;
and
an operational stress test circuit coupled to the functional element and operable during normal operation of the integrated circuit device to elevate the temperature of the functional element above a normal operating temperature and to perform stress testing on the functional element when the functional element is in an idle cycle and at the elevated temperature, the operational stress test circuit further comprising;
an idle cycle detect circuit for determining when the functional element is in an idle cycle;
a stress temperature generator coupled to the operational stress test controller, the stress temperature generator operable to elevate the temperature of the functional element above the normal operating temperature;
and
an operational stress test controller coupled to the idle cycle detect circuit, the operational stress test controller further operable to indicate if the functional element fails the stress testing.

4 more elements

Dependencies are inferred from the claim text.

Look-ahead built-in self tests with temperature elevation of functional elements

Life of this patent

Look-ahead built-in self tests with temperature elevation of functional elements

Life of this patent

Abstract

Claims27