Feeding structure of electrostatic chuck, method for producing the same, and method for regenerating feeding structure of electrostatic chuck

A method of manufacturing a power feeding structure of an electrostatic chuck including a lower insulation layer, an electrode layer and a surface insulation dielectric layer formed on a upper surface side of a metal substrate in order from the metal substrate, the power feeding structure including:

• a through hole formed through an upper surface and a lower surface of the metal substrate;
• a power feeding terminal disposed in the through hole for supplying a voltage supplied from a lower surface side of the metal substrate to the electrode layer formed on the upper surface side of the metal substrate;
• and
• an insulation holding member formed of an electric insulating material for insulating an inner wall of the through hole from the power feeding terminal and for holding the power feeding terminal,
• the method comprising the steps of:
• forming the lower insulation layer by thermal spraying of ceramic powder onto the upper surface side of the metal substrate having the through hole in which the power feeding terminal is disposed via the insulation holding member, a part of the power feeding terminal protruding to the upper surface side of the metal substrate;
• forming the electrode layer by thermal spraying of metal powder so that a tip of a power feeding end portion of the power feeding terminal protruding to the upper surface side of the metal substrate is embedded or the electrode layer is flush with the tip of the power feeding end portion;
• and
• forming the surface insulation dielectric layer by thermal spraying of ceramic powder.

A method of regenerating a power feeding structure of an electrostatic chuck including a lower insulation layer, an electrode layer and a surface insulation dielectric layer formed on a upper surface side of a metal substrate in order from the metal substrate, the power feeding structure including:

• a through hole formed through an upper surface and a lower surface of the metal substrate;
• a power feeding terminal disposed in the through hole for supplying a voltage supplied from a lower surface side of the metal substrate to the electrode layer formed on the upper surface side of the metal substrate;
• and
• an insulation holding member formed of an electric insulating material for insulating an inner wall of the through hole from the power feeding terminal and for holding the power feeding terminal,
• the method comprising the steps of:
• removing the surface insulation dielectric layer, the electrode layer and the lower insulation layer from the metal substrate of a used electrostatic chuck;
• forming the lower insulation layer by thermal spraying of ceramic powder onto the upper surface side of the metal substrate having the through hole in which the power feeding terminal is disposed via the insulation holding member, a part of the power feeding terminal protruding to the upper surface side of the metal substrate;
• forming the electrode layer by thermal spraying of metal powder so that a tip of a power feeding end portion of the power feeding terminal protruding to the upper surface side of the metal substrate is embedded or the electrode layer is flush with the tip of the power feeding end portion;
• and
• forming the surface insulation dielectric layer by thermal spraying of ceramic powder.