Substrate and electronic device using the same
AssigneeMurata Manufacturing Co., Ltd.
InventorsKazuo Hattori, Isamu Fujimoto
Life of this patent
Estimating the term…
Abstract
An electronic device which includes a feedthrough capacitor mounted on a front surface of a substrate. A feedthrough electrode penetrates a laminate (body of the capacitor). External electrodes are electrically connected to opposite ends of the feedthrough electrode. A capacitor electrode is disposed to form capacity in cooperation with the feedthrough electrode. A wiring conductor is formed on a rear surface of the substrate or inside the substrate, and via-hole conductors are connected to the wiring conductor. The feedthrough electrode and the external electrodes constitute a first current path. The wiring conductor and the via-hole conductors constitute a second current path electrically connected in parallel to the first current path.
Claims10
An electronic device comprising:
- a substrate having a first principal surface and a second principal surface;
- and
- a capacitor mounted on the first principal surface of the substrate,
- wherein the capacitor includes:
- a body;
- a feedthrough electrode penetrating the body;
- a capacitor electrode forming capacity in cooperation with the feedthrough electrode;
- a first external electrode and a second external electrode electrically connected to opposite ends of the feedthrough electrode, respectively;
- and
- a third external electrode electrically connected to the capacitor electrode, and wherein the substrate includes:
- a wiring conductor positioned one of on the second principal surface and inside the substrate;
- and
- a via-hole conductor formed inside the substrate and electrically connected to the wiring conductor,
- wherein the feedthrough electrode, the first external electrode, and the second external electrode constitute a first current path, and
- wherein the wiring conductor and the via-hole conductor constitute a second current path electrically connected in parallel to the first current path.
A substrate having a first principal surface and a second principal surface, the first principal surface configured for mounting a capacitor that includes a feedthrough electrode penetrating a capacitor body, and a capacitor electrode which forms capacity in cooperation with the feedthrough electrode, the substrate comprising:
- a wiring conductor positioned one of on the second principal surface and inside the substrate;
- and
- a via-hole conductor formed inside the substrate and electrically connected to the wiring conductor,
- wherein the wiring conductor and the via-hole conductor constitute a second current path electrically connected in parallel to a first current path in the capacitor.
Dependencies are inferred from the claim text.