Multilayer printed wiring board for semiconductor devices and method for manufacturing the board
AssigneeIbiden Co., Ltd.
InventorAyao Niki
Life of this patent
Estimating the term…
Abstract
A multilayer printed wiring board includes one or more resin layers having via-holes and a core layer having via-holes. The via-holes formed in the one or more resin layers are open in the direction opposite to the direction in which the via-holes formed in the core layer are open. A method for manufacturing a multilayer printed wiring board includes a step of preparing a single- or double-sided copper-clad laminate; a step of forming lands by processing the copper-clad laminate; a step of forming a resin layer on the upper surface of the copper-clad laminate, forming openings for via-holes in the resin layer, and then forming the via-holes; and a step of forming openings for via-holes in the lower surface of the copper-clad laminate and then forming the via-holes.
Claims12
A multilayer printed wiring board comprising:
- a lowermost insulating layer comprising a core layer and forming an outermost insulating layer having a via-hole structure;
- a conductive film formed on a surface of the lowermost insulating layer;
- a first via-hole structure comprising a plating material and formed through the lowermost insulating layer;
- a first resin layer formed over the surface of the lowermost insulating layer and the conductive film;
- a second via-hole structure comprising a plating material and formed through the first resin layer;
- a second resin layer formed on a surface of the first resin layer;
- and
- a third via-hole structure comprising a plating material and formed through the second resin layer,
- wherein the second via-hole structure through the first resin layer is tapered in a direction opposite to a direction in which the first via-hole structure through the lowermost insulating layer is tapered, the conductive film is sandwiched between the first via-hole structure and the second via hole structure, the first via-hole structure and the second via hole structure are in contact with the conductive film, and the third via-hole structure through the second resin layer is tapered in the direction opposite to the direction in which the first via-hole structure through the lowermost insulating layer is tapered.
A multilayer printed wiring board comprising:
- a lowermost insulating layer comprising a core layer and forming an outermost insulating layer having a via-hole structure;
- a conductive film formed on a surface of the lowermost insulating layer;
- a first resin layer formed over the lowermost insulating layer and the conductive film;
- a first via-hole structure formed through the lowermost insulating layer and comprising an electroless plating film and an electroplating film formed on the electroless plating film;
- and
- a second via-hole structure formed through the first resin layer and comprising an electroless plating film and an electroplating film formed on the electroless plating film;
- a second resin layer formed on a surface of the first resin layer;
- and
- a third via-hole structure comprising a plating material and formed through the second resin layer,
- wherein the second via-hole structure through the resin layer is tapered in a direction opposite to a direction in which the first via-hole structure through the lowermost insulating layer is tapered, the conductive film is sandwiched between the first via-hole structure and the second via hole structure, the first via-hole structure and the second via-hole structure are in contact with the conductive film, and the third via-hole structure through the second resin layer is tapered in the direction opposite to the direction in which the first via-hole structure through the lowermost insulating layer is tapered.
Dependencies are inferred from the claim text.