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US 8,027,161 B2Granted
Electronic power converter and mounting structure of semiconductor device
AssigneeDenso Corporation
InventorHiroshi Ishiyama
Life of this patent
Estimating the term…
Abstract
An electric power converter has a main circuit section including a semiconductor module and a cooling device; a control circuit substrate section electrically connected to a signal terminal of the semiconductor module, and having a control circuit; and a power wiring section connected to a main electrode terminal of the semiconductor module. The main circuit section is interposed between the control circuit substrate section and the power wiring section.
Claims2
A mounting structure of a semiconductor device, the structure comprising:
- a semiconductor module including a semiconductor element for supplying electricity, a first and a second electrode plates disposed on both sides of the semiconductor element, a connecting terminal connected to a control circuit for controlling the semiconductor element, and a resin mold having electric insulation for sealing the semiconductor element and the first and the second electrode plates;
- and
- a metallic casing accommodating cooling medium having electric conductivity, wherein a plurality of the semiconductor modules is proximally disposed in the cooling medium of the casing, wherein
- the first or second electrode plate, the cooling medium, a first or second mold portion of the resin mold provide a bypass capacitor for reducing noise.
1 more element
Dependencies are inferred from the claim text.