Method for manufacturing spectroscopy module, and spectroscopy module
AssigneeHamamatsu Photonics K.K.
InventorsKatsumi Shibayama, Tomofumi Suzuki
Life of this patent
Estimating the term…
Loading patent…
AssigneeHamamatsu Photonics K.K.
InventorsKatsumi Shibayama, Tomofumi Suzuki
Estimating the term…
In a spectroscopy module 1, a light detecting element 5 having a light passing hole 50 is used. Therefore, it is possible to prevent the relative positional relationship between the light passing hole 50 and a light detecting portion 5a of the light detecting element 5 from deviating. Moreover, the light detecting element 5 is electrically connected to a wiring 9 formed on a front plane 2a of a substrate 2 by face-down bonding, and a resin layer 79 is formed as an underfill resin between the substrate 2 and the light detecting element 5. Therefore, it is possible to improve the fixing strength between the substrate 2 and the light detecting element 5. Additionally, before the resin layer 79 is formed, a resin layer 78 is formed along a guide portion 77 that surrounds the passing hole 50. Thus, the resin layer 79 is prevented from penetrating into the light passing hole 50, which makes it possible to make a light be appropriately incident into the substrate 2.
A method for manufacturing a spectroscopy module which is provided with a body portion through which light is allowed to transmit, a spectroscopic portion that disperses a light made incident into the body portion from a side of a predetermined plane of the body portion, and reflects lights to the side of the predetermined plane, and a light detecting element which detects the lights dispersed by the spectroscopic portion, the method comprising the steps of:
Dependencies are inferred from the claim text.