Double-sided touch sensitive panel and flex circuit bonding

A method for bonding flex circuits to attachment areas on directly opposing sides of a substrate, comprising:

• forming a first attachment area on a first side of the substrate;
• forming a second attachment area on a second side of the substrate, the first attachment area directly opposing at least a portion of the second attachment area;
• applying a bonding head to the first attachment area of the first side to create a first bond between a first flex circuit portion and the first attachment area of the first side, the bonding head applying heat and pressure directly to the first flex circuit portion;
• and
• applying a cooling head to the second attachment area of the second side to maintain a previously formed second bond between a second flex circuit portion and the second attachment area of the second side.

A method for bonding flex circuits to attachment areas on directly opposing sides of a substrate, comprising:

• applying a first bonding head to a first side of the substrate to create a first bond between a first flex circuit portion and conductors in a first area of a first attachment area of the first side, the first bonding head shaped for applying heat and pressure to the first area;
• and
• applying a second bonding head to a second side of the substrate to create a second bond between a second flex circuit portion and conductors in a second area of a second attachment area of the second side, the second bonding head shaped for applying heat and pressure to the second area;
• wherein the first attachment area is directly opposing at least a portion of the second attachment area and the first and second areas are on non-opposing areas.

A method for bonding flex circuits to attachment areas on directly opposing sides of a substrate, comprising:

• forming a first attachment area on a first side of the substrate having conductors in a first area and forming a first flex circuit portion corresponding to the conductors on the first attachment area;
• forming a second attachment area on a second side of the substrate having conductors in a second area and forming a second flex circuit portion corresponding to the conductors on the second attachment area, the first attachment area directly opposing at least a portion of the second attachment area with the first and second areas on non-opposing areas;
• shaping a first bonding head to apply heat and pressure to the first area;
• shaping a second bonding head to apply heat and pressure to the second area;
• applying the first bonding head to the first side of the substrate to create a first bond between the first flex circuit portion and the conductors in the first area on the first attachment area of the first side;
• and
• applying the second bonding head to the second side of the substrate to create a second bond between the second flex circuit portion and the conductors in the second area on the second attachment area of the second side.

A system for bonding flex circuits to attachment areas on directly opposing sides of a substrate, comprising:

• a bonding head for creating a first bond between a first flex circuit portion and conductors on a first attachment area of a first side of the substrate, the bonding head configured for applying heat and pressure directly to the first flex circuit portion;
• and
• a cooling head configured in a directly opposing orientation as compared to the bonding head for maintaining a previously formed second bond between a second flex circuit portion and conductors on a second attachment area of a second side of the substrate;
• wherein the first attachment area is directly opposing at least a portion of the second attachment area on opposite sides of the substrate.

A system for bonding flex circuits to attachment areas on directly opposing sides of a substrate, comprising:

• a substrate having a first attachment area on a first side and a second attachment area on a second side, the first attachment area directly opposing at least a portion of the second attachment area;
• a bonding head for creating a first bond between a first flex circuit portion and the first attachment area of the first side, the bonding head applying heat and pressure directly to the first flex circuit portion;
• and
• a cooling head for maintaining a previously formed second bond between a second flex circuit portion and the second attachment area of the second side.

A system for bonding flex circuits to attachment areas on directly opposing sides of a substrate, comprising:

• a first bonding head for creating a first bond between a first flex circuit portion and conductors in a first area of a first attachment area of a first side of the substrate, the first bonding head shaped for applying heat and pressure to the first area;
• and
• a second bonding head for creating a second bond between a second flex circuit portion and conductors in a second area of a second attachment area of a second side of the substrate, the second bonding head shaped for applying heat and pressure to the second area;
• wherein the first attachment area is directly opposing at least a portion of the second attachment area and the first and second areas are on non-opposing areas.

A system for bonding flex circuits to attachment areas on directly opposing sides of a substrate, comprising:

• a substrate having a first attachment area on a first side and a second attachment area on a second side, the first attachment area having conductors in a first area and the second attachment area having conductors in a second area, the first attachment area directly opposing at least a portion of the second attachment area with the first and second areas on non-opposing areas of the substrate;
• a first flex circuit portion configured to correspond with the conductors on the first attachment area;
• a second flex circuit portion configured to correspond with the conductors on the second attachment area;
• a first bonding head shaped to apply heat and pressure to the first area to create a first bond between the first flex circuit portion and the conductors in the first area on the first attachment area of the first side;
• and
• a second bonding head shaped to apply heat and pressure to the second area to create a second bond between the second flex circuit portion and the conductors in the second area on the second attachment area of the second side.

A flex circuit for bonding to a substrate, comprising:

• a ribbon area;
• an attachment area connected to the ribbon area;
• coverlay applied over first trace portions on the ribbon area and second trace portions on the attachment area;
• a spacer formed at a distal end of the attachment area, the spacer and coverlay on non-opposing areas on opposite sides of the flex circuit, the spacer configured for enabling a bonding head to apply heat and pressure to the attachment area to bond the attachment area to the substrate.