Interface structure of wafer test equipment

A wafer test equipment system, comprising:

• a performance board connected to a tester head of a tester;
• a universal block printed circuit board positioned on the performance board, directly connecting a plurality of normal signal lines to a probe card and dividing each of a plurality of power signal lines into multiple paths and connecting them to the probe card;
• a cable assembly transferring the normal signal lines and the power signal lines between the universal block printed circuit board and the tester head, the cable assembly soldered directly to the universal block printed circuit board in a perpendicular direction through a center portion of the performance board;
• and
• a probe card that is removably secured to the performance board including the universal block printed circuit board, the probe card including an interposer on an upper surface thereof, a ceramic multi-layer substrate positioned below the interposer, and a plurality of needles positioned below the ceramic multi-layer substrate on a lower surface thereof opposite the upper surface,
• wherein the performance board and the probe card are removably secured to each other via levers of a ZIF connector at an outer portion of the probe card that surrounds the interposer.

A wafer test equipment system, comprising:

• a performance board connected to a tester head of a tester;
• a universal block printed circuit board positioned on the performance board, directly connecting a plurality of normal signal lines to a probe card and dividing each of a plurality of power signal lines into multiple paths and connecting them to the probe card;
• a cable assembly transferring the normal signal lines and the power signal lines between the universal block printed circuit board and the tester head, the cable assembly soldered directly to the universal block printed circuit board in a perpendicular direction through a center portion of the performance board;
• and
• a probe card that is removably secured to the performance board including the universal block printed circuit board, the probe card including an interposer on an upper surface thereof, a ceramic multi-layer substrate positioned below the interposer, and a plurality of needles positioned below the ceramic multi-layer substrate on a lower surface thereof opposite the upper surface,
• wherein the power signal lines in the cable assembly are soldered directly to an upper surface of the universal printed circuit board of the performance board.

A wafer test equipment system, comprising:

• a performance board connected to a tester head of a tester;
• a universal block printed circuit board positioned on the performance board, directly connecting a plurality of normal signal lines to a probe card and dividing each of a plurality of power signal lines into multiple paths and connecting them to the probe card;
• a cable assembly transferring the normal signal lines and the power signal lines between the universal block printed circuit board and the tester head, the cable assembly soldered directly to the universal block printed circuit board in a perpendicular direction through a center portion of the performance board;
• and
• a probe card that is removably secured to the performance board including the universal block printed circuit board, the probe card including an interposer on an upper surface thereof, a ceramic multi-layer substrate positioned below the interposer, and a plurality of needles positioned below the ceramic multi-layer substrate on a lower surface thereof opposite the upper surface,
• wherein the normal signal lines in the cable assembly are soldered directly to an upper surface of the universal printed circuit board of the performance board.

A wafer test equipment system, comprising:

• a performance board connected to a tester head of a tester;
• a universal block printed circuit board positioned on the performance board, directly connecting a plurality of normal signal lines to a probe card and dividing each of a plurality of power signal lines into multiple paths and connecting them to the probe card;
• a cable assembly transferring the normal signal lines and the power signal lines between the universal block printed circuit board and the tester head, the cable assembly soldered directly to the universal block printed circuit board in a perpendicular direction through a center portion of the performance board;
• and
• a probe card that is removably secured to the performance board including the universal block printed circuit board, the probe card including an interposer on an upper surface thereof, a ceramic multi-layer substrate positioned below the interposer, and a plurality of needles positioned below the ceramic multi-layer substrate on a lower surface thereof opposite the upper surface,
• wherein ground lines surround the outer portions of the power signal lines and the normal signal lines in the cable assembly, and are connected to ground conductive layers, respectively, formed on an upper surface and a lower surface of the universal block printed circuit board.