Semiconductor device comprising a plastic housing, a semiconductor chip and an interposer including a convex or concave lens-shape top side fitting shape

A device comprising:

• a plastic housing comprising a plastic housing composition;
• a chip including an active top side and a rear side;
• and
• an interposer including a top side, edge sides and an underside opposing the top side, wherein the underside is secured on the active top side of the semiconductor chip, the edge sides are at least partially embedded into the plastic housing composition, the top side of the interposer includes a convex or concave lens-shaped top side fitting shape having a predetermined radius of curvature, at least part of the fitting shape being outside and not embedded within the plastic housing composition, and at least the convex or concave lens-shaped top side fitting shape of the interposer includes a coating of a ductile material;
• wherein the coating of at least the convex or concave lens-shaped top side fitting shape of the interposer comprises indium, and the indium is not combined with any other element to form an oxide.