Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another
AssigneeTessera, Inc.
InventorsIlyas Mohammed, Belgacem Haba
Life of this patent
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Abstract
A microelectronic assembly including a first and second microelectronic elements. Each of the microelectronic elements have oppositely-facing first and second surfaces and edges bounding the surfaces. The first microelectronic element is disposed on the second microelectronic element with the second surface of the first microelectronic element facing toward the first surface of the second microelectronic element. The first microelectronic element preferably extends beyond at least one edge of the second microelectronic element and the second microelectronic element preferably extends beyond at least one edge of the first microelectronic element.
Claims9
A microelectronic assembly comprising:
- a substrate having a top surface, a bottom surface and a first edge extending between said top surface and said bottom surface, said substrate having a plurality of bonding contacts exposed at said top surface and a plurality of terminals, said substrate further having a plurality of traces connecting at least some of said bonding contacts to at least some of said plurality of terminals, at least some of said plurality of traces extending adjacent said first edge of the substrate so that said at least some of said plurality of traces are disposed between at least some of said bonding contacts and said first edge;
- and
- a first microelectronic element underlying said substrate such that said bottom surface of said substrate faces toward said first microelectronic element, said first microelectronic element having contacts, at least some of said contacts being connected to at least some of said plurality of bonding contacts by wire leads, wherein at least some of said wire leads extend from at least some of said bonding contacts exposed at said top surface, over at least some of said plurality of traces and are not conductively connected with said at least some of said plurality of traces, and wherein said wire leads extend beyond said first edge to said contacts of said microelectronic element below said bottom surface of said substrate.
A microelectronic assembly comprising:
- a substrate having a top surface, a bottom surface and a first edge extending between said top surface and said bottom surface, said substrate having a plurality of bonding contacts exposed at said top surface and a plurality of terminals, said substrate further having a plurality of traces connecting at least some of said bonding contacts to at least some of said plurality of terminals, at least some of said traces extending adjacent said first edge of the substrate so that at least some of said traces are disposed between at least some of said bonding contacts and said first edge;
- and a first microelectronic element underlying said substrate such that said bottom surface of said substrate faces toward said first microelectronic element, said first microelectronic element having contacts, at least some of said contacts being connected to at least some of said plurality of bonding contacts by wire leads, wherein at least some of said wire leads extend from at least some of said bonding contacts exposed at said top surface over at least some of said plurality of traces to said contacts of the microelectronic element,
- wherein at least one of the wire leads extends from at least one of said bonding contacts over at least some of said plurality of traces and wherein at least one of said plurality of traces is not electrically connected with at least one of said bonding contacts.
Dependencies are inferred from the claim text.