Interconnect layers without electromigration

A structure, comprising:

• (a) an interlevel dielectric (ILD) layer;
• (b) a first electrically conductive line and a second electrically conductive line both residing in the ILD layer;
• (c) a flux relaxation region residing in the ILD layer,
• wherein the flux relaxation region (i) physically isolates, (ii) electrically couples together, and (iii) are in direct physical contact with the first and second electrically conductive lines,
• wherein the first and second electrically conductive lines and the flux relaxation region each comprises at least an electrically conductive material,
• wherein if an electric current flows in a first direction from the first electrically conductive line to the second electrically conductive line through the flux relaxation region, then a first resulting current density in the flux relaxation region would be lower than a second resulting current density in each of the first and second electrically conductive lines,
• wherein the first electrically conductive line has a first width in a second direction that is perpendicular to the first direction such that the first width is spatially constant throughout a total spatial length of the first electrically conductive line in the first direction,
• wherein the second electrically conductive line has a second width in the second direction such that the second width is spatially constant throughout a total spatial length of the second electrically conductive line in the first direction,
• wherein the flux relaxation region has a third width in the second direction such that the third width in the second direction exceeds both the first width of the first electrically conductive line in the second direction and the second width of the second electrically conductive line in the second direction throughout a total spatial length of the flux relaxation region in the first direction.

A structure, comprising:

• (a) a first interlevel dielectric (ILD) layer;
• (b) an electrically conductive line residing in the first ILD layer;
• (c) a second ILD layer on top of the first ILD layer;
• (d) an electrically conductive via residing in the second ILD layer;
• and
• (e) a redundant current path region residing in the first ILD layer,
• wherein the electrically conductive line, the electrically conductive via, and the redundant current path region each comprises at least an electrically conductive material,
• wherein the electrically conductive via is electrically coupled to the electrically conductive line through a first electrical current path and a second electrical current path,
• wherein the first electrical current path goes through the redundant current path region,
• wherein the second electrical current path does not go through the redundant current path region, and
• wherein the first electrical current path is different from the second electrical current path.