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US 8,026,593 B2Granted
Integrated circuit package system with protected conductive layers for pads and method of manufacturing thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsYaojian Lin, Haijing Cao, Qing Zhang
Life of this patent
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Abstract
An integrated circuit package system is provided including providing an integrated circuit die having a contact pad, forming a protection cover over the contact pad, forming a passivation layer having a first opening over the protection cover with the first opening exposing the protection cover, developing a conductive layer over the passivation layer, and forming a pad opening in the protection cover for exposing the contact pad.
Claims10
An integrated circuit package system comprising:
- an integrated circuit die having a contact pad thereover;
- a protection cover over the contact pad for protecting the contact pad;
- a passivation layer having a first opening over the protection cover having a pad opening with the contact pad exposed through the passivation layer and the protection cover;
- a conductive layer over the passivation layer, the conductive layer partially removed exposing the contact pad;
- and
- an interconnect directly on the contact pad and only adjacent to the protection cover and the passivation layer without direct contact with the passivation layer.
3 more elements
Dependencies are inferred from the claim text.