Semiconductor device with lead terminals having portions thereof extending obliquely
AssigneeRohm Co., Ltd.
InventorKazutaka Shibata
Life of this patent
Estimating the term…
Abstract
A semiconductor device in which a semiconductor chip, a lead frame and metal wires for electrically connecting the lead frame are sealed with sealing resin. The lead frame has a plurality of lead terminal portions, a supporting portion for supporting the semiconductor chip, and hanging lead portions supporting the supporting portion. Each of the lead terminal portions adjacent to the hanging lead portion is a chamfered lead terminal portion having, at its head, a chamfered portion formed substantially in parallel with the hanging lead portion so as to avoid interference with the hanging lead portion.
Claims31
A semiconductor device, comprising:
- a semiconductor chip having electrodes on the surface thereof,
- a plurality of lead terminal portions for electrical connection, a supporting portion on which the semiconductor chip is mounted,
- hanging lead portions each extending obliquely with respect to the lead terminal portions and supporting the supporting portion,
- metal wires for connecting the lead terminal portions and the electrodes of the semiconductor chip to each other, and
- a sealing resin for sealing the semiconductor chip and the metal wires in such a manner that a part of each lead terminal portion is exposed,
- wherein:
- lead terminal portions, among the plurality of the lead terminal portions, arranged adjacent to the hanging lead portions, each have a chamfered portion arranged at a head end thereof such that the chamfered portion extends substantially parallel with the hanging lead portion so as to avoid interference with the hanging lead portion, and
- the chamfered portion extends obliquely with respect to the lead portion having the chamfered portion.
Dependencies are inferred from the claim text.