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US 8,026,590 B2Granted
Die package and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJoon Seok Kang, Young Ho Kim, Young Do Kweon, Jin Gu Kim, Sung Yi
Life of this patent
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Abstract
Disclosed herein are a die package and a method of manufacturing the die package. A solder layer is formed on a lower surface of a die. The die is self-aligned and attached to a support plate using surface tension between the solder layer and a metal layer of the support plate, thus reducing attachment lead time of the die.
Claims16
A die package, comprising:
- a support plate made of metal, the support plate having a die attachment area on an upper surface thereof, with an alignment assisting insulation layer formed on the upper surface of the support plate, the alignment assisting insulation layer being open on the die attachment area of the support plate;
- a die having a solder layer formed on a lower surface thereof, and a pad formed on an upper surface thereof, the die being mounted to the die attachment area of the support plate through the solder layer;
- a metal post formed on the pad of the die;
- an encapsulation layer formed on the alignment assisting insulation layer and the die such that an upper surface of the metal post is exposed outside the encapsulation layer;
- a redistribution layer connected at a first end thereof to the metal post, the redistribution layer extending a predetermined length on the encapsulation layer;
- and
- a solder resist layer formed on the encapsulation layer, the solder resist layer having an opening such that the second end of the redistribution layer is exposed outside through the opening of the solder resist layer.
4 more elements
A die package, comprising:
- a support plate having a die attachment area thereon, with an alignment guide metal layer formed on the die attachment area of the support plate;
- a die having a solder layer formed on a lower surface thereof, and a pad formed on an upper surface thereof, the die being mounted to the die attachment area of the support plate through the solder layer;
- a metal post formed on the pad of the die;
- an encapsulation layer formed on the support plate and the die such that an upper surface of the metal post is exposed outside the encapsulation layer;
- a redistribution layer connected at a first end thereof to the metal post, the redistribution layer extending a predetermined length on the encapsulation layer;
- and
- a solder resist layer formed on the encapsulation layer, the solder resist layer having an opening such that the second end of the redistribution layer is exposed outside through the opening of the solder resist layer.
4 more elements
A method of manufacturing a die package, comprising:
- forming an alignment assisting insulation layer on an upper surface of a support plate made of metal, the support plate having a die attachment area on an upper surface thereof, the alignment assisting insulation layer being open on the die attachment area of the support plate;
- mounting a die having a solder layer on a lower surface thereof to the die attachment area of the support plate using surface tension between the solder layer and the support plate;
- forming a metal post connected to a pad provided on an upper surface of the die, and forming an encapsulation layer such that an upper surface of the metal post is exposed outside the encapsulation layer;
- forming a redistribution layer extending a predetermined length on the encapsulation layer such that a first end of the redistribution layer is connected to the metal post;
- and
- forming a solder resist layer on the encapsulation layer and the redistribution layer, the solder resist layer having an opening such that the second end of the redistribution layer is exposed outside through the opening of the solder resist layer.
3 more elements
A method of manufacturing a die package, comprising:
- forming an alignment guide metal layer on a die attachment area of a support plate;
- mounting a die having a solder layer on a lower surface thereof to the die attachment area of the support plate using surface tension between the solder layer and the alignment guide metal layer;
- forming a metal post connected to a pad provided on an upper surface of the die, and forming an encapsulation layer such that an upper surface of the metal post is exposed outside the encapsulation layer;
- forming a redistribution layer extending a predetermined length on the encapsulation layer such that a first end of the redistribution layer is connected to the metal post;
- and
- forming a solder resist layer on the encapsulation layer and the redistribution layer, the solder resist layer having an opening such that the second end of the redistribution layer is exposed outside through the opening of the solder resist layer.
3 more elements
Dependencies are inferred from the claim text.