Semiconductor package, module, system having solder ball coupled to chip pad and manufacturing method thereof

A semiconductor package, comprising:

• a first semiconductor package comprising a first circuit board including a first through hole therein, a first conductor formed on a sidewall of the first through hole, a first semiconductor chip including a first chip pad mounted on the first circuit board, a second semiconductor chip including a second chip pad formed on the first semiconductor chip, a penetration electrode electrically connecting the first semiconductor chip with the second semiconductor chip, a first solder ball disposed in the first through hole to connect the first conductor with the first chip pad, and a sealing resin encapsulating the first circuit board, the first semiconductor chip, and the second semiconductor chip;
• and
• a second semiconductor package comprising a second circuit board including a second through hole therein, a second conductor formed on a sidewall of the second through hole, a third semiconductor chip including a third chip pad mounted on the second circuit board, a fourth semiconductor chip including a fourth chip pad formed on the third semiconductor chip, a conductive member electrically connecting the third semiconductor chip with the fourth semiconductor chip, a second solder ball disposed in the second through hole to connect the second conductor with the third chip pad, and a sealing resin encapsulating the second circuit board, the third semiconductor chip, and the fourth semiconductor chip,
• wherein the second semiconductor package is formed on the first semiconductor package and electrically connected with the first semiconductor package through the second solder ball.