Flip-chip module and method for the production thereof

Method of producing a flip-chip module comprising:

• for a semiconductor chip having on one face contact posts projecting from this face, with each of the contact posts having a soldered section with solder material and a post, forming an elongated section made of an electrically conductive material which does not melt at the melting temperature of the soldering material,
• for a substrate with contact points, each being soldered to a free end of one of the contact posts, wherein firstly a spacer is arranged between the semiconductor chip and the substrate, soldering the contact posts to the contact points of the substrate.

Method of producing a flip-chip module, the method comprising:

• providing a semiconductor chip having on one face contact posts projecting from this face,
• providing a substrate with contact points, each connected with solder to a free end of one of the contact posts, wherein the substrate has a different thermal coefficient of expansion to that of the semiconductor chip, and
• positioning a rigid spacer between the substrate and the semiconductor chip, the rigid spacer having a thermal coefficient of expansion varying less from the thermal coefficient of expansion of the semiconductor chip than from the thermal coefficient of expansion of the substrate, wherein the spacer is connected either to the substrate and/or to the semiconductor chip at least at several points distributed over its contact faces.