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US 8,026,582 B2Granted
Integrated circuit package system with internal stacking module adhesive
AssigneeSTATS ChipPAC, Ltd.
InventorsMyung Kil Lee, Jae Chang Kim, Koo Hong Lee
Life of this patent
Estimating the term…
Abstract
An integrated circuit package system comprising: providing a substrate; forming a base assembled package over the substrate; forming a top package over the base assemble package; and applying a top package stacking material for stand-off or insulation to the base assembled package and the top package.
Claims20
A method of manufacture of an integrated circuit package system comprising:
- providing a substrate;
- forming a base assembled package over the substrate;
- forming a top package;
- applying a top package stacking material for stand-off or insulation to the top package;
- and
- stacking the top package over the base assembled package with the top package stacking material embedding connectors between the base assembled package and the substrate, and the top package stacking material extends laterally beyond the base assembled package.
3 more elements
A method of manufacture of an integrated circuit package system comprising:
- providing a base substrate;
- attaching a base integrated circuit die over the base substrate;
- attaching base die connectors to the base integrated circuit die and the base substrate;
- forming a top package having a top integrated circuit die;
- applying a top package stacking material for stand-off or insulation to the package;
- and
- stacking the top package over the base integrated circuit die with the base die connectors partially embedded within the top package stacking material and with the top package stacking material extending laterally beyond the base integrated circuit die.
4 more elements
An integrated circuit package system comprising:
- a substrate;
- a base assembled package over the substrate;
- a top package over the base assembled package;
- and
- a top package stacking material for stand-off or insulation applied to the base assembled package and the top package with the top package stacking material embedding connectors between the base assembled package and the substrate, and top package stacking material extends laterally beyond the base assembled package.
2 more elements
Dependencies are inferred from the claim text.